PDP TRENCH IGBT
PDP TRENCH IGBT
PD - 96192A
IRG6I330UPbF
Features l Advanced Trench IGBT Technology l Optimized for Sustain and Energy...
Description
PDP TRENCH IGBT
PD - 96192A
IRG6I330UPbF
Features l Advanced Trench IGBT Technology l Optimized for Sustain and Energy Recovery
circuits in PDP applications l Low VCE(on) and Energy per Pulse (EPULSETM)
for improved panel efficiency l High repetitive peak current capability l Lead Free package
Key Parameters
VCE min VCE(ON) typ. @ IC = 28A IRP max @ TC= 25°C TJ max
330 1.30 250 150
C
V V A °C
G
CE G
E
n-channel
TO-220AB Full-Pak
G Gate
C Collector
E Emitter
Description This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced trench IGBT technology to achieve low VCE(on) and low EPULSETM rating per silicon area which improve panel efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications.
Absolute Maximum Ratings
Parameter
VGE IC @ TC = 25°C IC @ TC = 100°C IRP @ TC = 25°C PD @TC = 25°C PD @TC = 100°C
Gate-to-Emitter Voltage Continuous Collector Current, VGE @ 15V Continuous Collector, VGE @ 15V
cRepetitive Peak Current
Power Dissipation
Power Dissipation
Linear Derating Factor
TJ TSTG
Operating Junction and Storage Temperature Range Soldering Temperature for 10 seconds
Mounting Torque, 6-32 or M3 Screw
Thermal Resistance
Parameter
dRθJC
Junction-to-Case
Max. ±30 28 15 250 43 17 0.34 -40 to + 150
300
x x10lb in (1.1N m)
Typ. –––
Max...
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