ESD8504G

ESD8504G ESD Protection Diode Low Capacitance Array for High Speed Data Lines The ESD8504G is designed to protect high speed data lines from ESD. Ultra−low capacitance and low ESD clamping voltage make this device an ideal solution for protecting voltage sensitive high speed data lines. The flow−through style package allows for easy PCB layout and matched trace lengths necessary to maintain consistent impedance between high speed differential lines such as USB 3.0/3.1. Features Low Capacitance (0.5 pF Max, I/O to GND) Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) Low ESD Clamping Voltage These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications USB 3.0/3.1 eSATA DisplayPort MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg − 55 to +150 °C Lead Solder Temperature − Maximum (10 Seconds) TL 260 °C IEC 61000−4−2 Contact (ESD) IEC 61000−4−2 Air (ESD) ESD ESD ±25 kV ±25 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com UDFN10 CASE 517BB MARKING DIAGRAM 4GMG G 4G = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN CONFIGURATION AND SCHEMATIC N/C N/C GN...