Power MOSFET
NVMFS5833N
Power MOSFET
40 V, 7.5 mW, 86 A, Single N−Channel, SO−8FL
Features
• Low RDS(on) • Low Capacitance • Optimiz...
Description
NVMFS5833N
Power MOSFET
40 V, 7.5 mW, 86 A, Single N−Channel, SO−8FL
Features
Low RDS(on) Low Capacitance Optimized Gate Charge AEC−Q101 Qualified and PPAP Capable NVMFS5833NWF − Wettable Franks Option for Enhanced Optical
Inspection
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current RYJ−mb (Notes 1, 2, 3 & 4)
Power Dissipation RYJ−mb (Notes 1, 2, 3)
Steady State
Tmb = 25°C Tmb = 100°C Tmb = 25°C Tmb = 100°C
Continuous Drain Current RqJA (Notes 1, 3 & 4)
Power Dissipation RqJA (Notes 1 & 3)
Steady State
TA = 25°C TA = 100°C TA = 25°C TA = 100°C
Pulsed Drain Current TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS VGS ID
PD
ID
PD
IDM TJ, Tstg
40 "20
86 61 112 56 16 11 3.7 1.8 324 −55 to 175
V V A
W
A
W
A °C
Source Current (Body Diode)
IS 86 A
Single Pulse Drain−to−Source Avalanche
EAS 65 mJ
Energy (TJ = 25°C, IL(pk) = 36 A, L = 0.1 mH)
Lead Temperature for Soldering Purposes (1/8″ from case for 10 s)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Mounting Board (top) − Steady State (Notes 2, 3)
RYJ−mb
1.3 °C/W
Junction...
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