SSF6N40D

Main Product Characteristics VDSS 400V RDS(on) 0.85Ω (typ.) ID 5.5A Features and Benefits TO-252  Advanced MOSFET process technology  Special designed for PWM, load switching and general purpose applications  Ultra low on-resistance with low gate charge  Fast switching and reverse body recovery  150℃ operating temperature  Lead free product SSF6N40D 400V N-Channel MOSFET Marking and Pin Assignment Schematic Diagram Description It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute Max Rating Symbol ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VDS VGS EAS IAS TJ TSTG Parameter Continuous Drain Current, VGS @ 10V① Continuous Drain Current, VGS @ 10V① Pulsed Drain Current② Power Dissipation③ Linear Derating Factor Drain-Source Voltage Gate-to-Source Voltage Single Pulse Avalanche Energy @ L=22mH Avalanche Current @ L=22mH Operating Junction and Storage Temperature Range Max. 5.5 3.5 22 50 0.4 400 ± 30 345 5.6 -55 to +150 Units A W W/°C V V mJ A °C www.goodark.com Page 1 of 7 Rev.1.0 SSF6N40D 400V N-Channel MOSFET Thermal Resistance Symbol RθJC RθJA Characteristics Junction-to-case③ Junction-to-ambient (t ≤ 10s) ④ Typ. — — Max. 2.5 110 Units ℃/W ℃/W Electrical Characteristics @TA=2...