Power MOSFET
l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Swit...
Description
l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Optimized for SMPS Applications
PD - 95884
IRFB4215
HEXFET® Power MOSFET
D VDSS = 60V
RDS(on) = 9.0mΩ
G
ID = 115A
S
Description
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of applications.
TO-220AB
Absolute Maximum Ratings
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C
VGS IAR EAR dv/dt TJ TSTG
Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation
Linear Derating Factor Gate-to-Source Voltage Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and
Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 srew
Thermal Resistance
RθJC RθCS RθJA
www.irf.com
Parameter Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient
Max. 115
81 360 270 1.8 ± 20 85 18 4.7 -55 to + 175
300 (1.6mm from case ) 10 lbfin (1.1Nm)
Typ. ––– 0.24 –––
Max. 0.56 ––– 40
Units A W
W/°C V A mJ
V/ns
°C
Units °C/W
1 7/7/04
IRFB4215
Electrical Ch...
Similar Datasheet