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R5F51303ADFK Dataheets PDF



Part Number R5F51303ADFK
Manufacturers Renesas
Logo Renesas
Description 32-bit RX MCUs
Datasheet R5F51303ADFK DatasheetR5F51303ADFK Datasheet (PDF)

Datasheet RX130 Group Renesas MCUs 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory, R01DS0273EJ0100 Rev.1.00 Oct 30, 2015 up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply Features ■ 32-bit RX CPU core  Max. operating frequency: 32 MHz Capable of 50 DMIPS in operation at 32 MHz  Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations  Multiplication.

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Datasheet RX130 Group Renesas MCUs 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory, R01DS0273EJ0100 Rev.1.00 Oct 30, 2015 up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply Features ■ 32-bit RX CPU core  Max. operating frequency: 32 MHz Capable of 50 DMIPS in operation at 32 MHz  Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations  Multiplication and division unit handles 32-bit × 32-bit operations (multiplication instructions take one CPU clock cycle)  Fast interrupt  CISC Harvard architecture with 5-stage pipeline  Variable-length instructions, ultra-compact code  On-chip debugging circuit ■ Low power design and architecture  Operation from a single 1.8-V to 5.5-V supply  Three low power consumption modes  Low power timer (LPT) that operates during the software standby state  Supply current High-speed operating mode: 96 A/MHz Supply current in software standby mode: 0.37 A  Recovery time from software standby mode: 4.8 s ■ On-chip flash memory for code, no wait states  Operation at 32 MHz, read cycle of 31.25 ns  No wait states for reading at full CPU speed  Programmable at 1.8 V  For instructions and operands ■ On-chip data flash memory  8 Kbytes (1,000,000 program/erase cycles (typ.))  BGO (Background Operation) ■ On-chip SRAM, no wait states  10- to 16-Kbyte size capacities ■ DTC  Four transfer modes  Transfer can be set for each interrupt source. ■ ELC  Module operation can be initiated by event signals without using interrupts.  Linked operation between modules is possible while the CPU is sleeping. ■ Reset and supply management  Eight types of reset, including the power-on reset (POR)  Low voltage detection (LVD) with voltage settings ■ Clock functions  External clock input frequency: Up to 20 MHz  Main clock oscillator frequency: 1 to 20 MHz  Sub clock oscillator frequency: 32.768 kHz  PLL circuit input: 4 MHz to 8 MHz  Low-speed on-chip oscillator: 4 MHz  High-speed on-chip oscillator: 32 MHz ± 1 %  IWDT-dedicated on-chip oscillator: 15 kHz  Generate a 32.768 kHz clock for the real-time clock  On-chip clock frequency accuracy measurement circuit (CAC) ■ Realtime clock  Adjustment functions (30 seconds, leap year, and error)  Calendar count mode or binary count mode selectable ■ Independent watchdog timer  15-kHz on-chip oscillator produces a dedicated clock signal to drive IWDT operation. ■ Useful functions for IEC60730 compliance  Self-diagnostic and disconnection-detection assistance functions for the A/D converter, clock frequency accuracy measurement circuit, independent watchdog timer, RAM test assistance functions using the DOC, etc. PLQP0080KB-B 12 × 12mm, 0.5mm pitch PLQP0064GA-A 14 × 14mm, 0.8mm pitch PLQP0064KB-C 10 × 10mm, 0.5mm pitch PLQP0048KB-B 7 × 7mm, 0.5mm pitch PWQN0048KB-A 7 × 7mm, 0.5mm pitch ■ MPC  Input/output functions selectable from multiple pins ■ Up to 6 communication functions  SCI with many useful functions (up to 4 channels) Asynchronous mode (Fine adjustable baud rate: 0 to 255/255), clock synchronous mode, smart card interface mode  I2C bus interface: Transfer at up to 400 kbps, capable of SMBus operation (one channel)  RSPI (one channel): Transfer at up to 16 Mbps ■ Up to 12 extended-function timersMPC  16-bit MTU: input capture, output compare, complementary PWM output, phase counting mode (six channels)  8-bit TMR (four channels)  16-bit compare-match timers (two channels) ■ 12-bit A/D converter  Capable of conversion within 1.4 μs  17 channels  Sampling time can be set for each channel  Conversion results compare features  Self-diagnostic function and analog input disconnection detection assistance function  Double trigger (data duplication) function for motor control ■ D/A converter  Two channels ■ Capacitive touch sensing unit  Self-capacitance method: A single pin configures a single key, supporting up to 36 keys  Mutual capacitance method: Matrix configuration with 36pins, supporting up to 324 keys ■ Comparator B  Two channels ■ General I/O ports  5-V tolerant, open drain, input pull-up, switching of driving capacity ■ Temperature sensor ■ Unique ID  32-byte ID code for the MCU ■ Operating temperature range  40 to +85C  40 to +105C ■ Applications  General industrial and consumer equipment R01DS0273EJ0100 Rev.1.00 Oct 30, 2015 Page 1 of 116 RX130 Group 1. Overview 1. Overview 1.1 Outline of Specifications Table 1.1 lists the specifications, and Table 1.2 gives a comparison of the functions of the products in different packages. Table 1.1 is for products with the greatest number of functions, so the number of peripheral modules and channels will differ in accordance with the package type. For details, see Table 1.2, Comparison of Functions for Different Packages in the RX130 Group. Table 1.1 Outline of Specifications (1/3) Classification M.


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