Document
SMD Zener Diode
BZT55 Series
Formosa MS
List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3~4 Rating and characteristic curves........................................................ 5 Pinning information...........................................................................6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 High reliability test capabilities...........................................................9
http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141
Page 1
Document ID Issued Date
DS-221735
2009/08/10
Revised Date 2010/05/10
Revision C
Page. 9
SMD Zener Diode
BZT55 Series
500mW Surface Mount Zener Diodes - 2.0V-51V
Features
• Silicon epitaxial planar chip structure. • Zener Breakdown Voltage Range, 2.4V to 51V ex.BZT55C2V4 • Zener Breakdown Voltage Range, 2.0V to 36V ex.BZT55B2V0 • Small package size for high density applications. • Ideally suited for automated assembly processes. • Pb-Free package is available. • Suffix "-H" indicates Halogen-free parts, ex.BZT55C2V4-H.
0.071(1.80) 0.055(1.40)
Formosa MS
Package outline
SOD-123F
0.110(2.80) 0.098(2.50)
0.028(0.70) 0.019(0.50)
Mechanical data
• Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123F • Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.010 gram
0.008(0.20)MAX
0.053(1.35) 0.037(0.95)
0.154(3.90) 0.141(3.60)
Dimensions in inches and (millimeters)
Maximum ratings (at TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward voltage
@IF = 10mA
Total power dissipation Thermal resistance
at TA=25oC Mounted on FR-5 board, note1
Junction to ambient, note1 Junction to case, note1
Operating junction temperature range
Storage temperature range
Note1.Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad area 25mm2
Symbol MIN.
VF
PD
RθJA RθJC
TJ TSTG
-55 -55
TYP.
305 200
MAX. 0.9 500
+150 +150
UNIT
V
mW
OC/W OC/W
oC oC
http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141
Page 2
Document ID Issued Date
DS-221735
2009/08/10
Revised.