MULTILAYER CERAMIC CHIP CAPACITORS
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Surface Mount Device
?FEATURES
1. Large capacitance by small size.
2. Excel...
MULTILAYER CERAMIC CHIP CAPACITORS
Upgrade!
Surface Mount Device
?FEATURES
1. Large capacitance by small size.
2. Excellent noise absorption.
3. High permissible ripple current capability. 4. Pb-free design.
5. Tin plate terminations.
?APPLICATIONS
1. Smoothing circuit of DC-DC converters.
2. On-board power supplies.
3. Voltage
regulators for computers. 3. Noise suppressor for various kinds of equipments.
4. High reliability equipments.
?CONSTRUCTION
Ceramic Dielectric
Termination (Tin Plating)
Internal Electrode
?RATINGS
1. Category Temperature Range 2. Rated Voltage Range 3. Rated Capacitance Range 4. Rated Capacitance Tolerance 5. Temperature Characteristics 6. Rated Ripple Current
-55 to +125C 25, 50, 100, 250Vdc 0.033 to 33MF K (P10%) , M (P20%) X5R, X7R See No.5 on the following table
?SPECIFICATIONS
No. Items 1 Withstand Voltage 2 Insulation Resistance
3 Rated Capacitance
Specification No abnormality. 100/CR(MO) or 4000(MO) whichever is less.
Within specified tolerance.
4 Dissipation Factor
5.0% maximum.
5 Rated Ripple Current
Size code 31 32 43 55 Arms 0.3 0.5 1.0 2.0
Test Condition 250% of rated voltage shall be applied for 5 seconds.
Rated voltage shall be applied for 60P5 seconds at temperature 25P2C.
Temperature Frequency Voltage
CR[10MF
CR>10MF
25P2C
1P0.1kHz
120P12Hz
1P0.2Vrms
0.5P0.2Vrms
10kHzK1MHz (sine curve) Ripple voltage Vp shall be less than the rated voltage.
(1/3)
CAT. No. E1002I
MULTILAYER CERAMIC CHIP CAPACITORS
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