Document
MPPS™ Miniature Package Power Solutions 50V NPN LOW SATURATION TRANSISTOR
SUMMARY VCEO= 50V; RSAT = 68m ; IC= 4A
DESCRIPTION
Packaged in the innovative 2mm x 2mm MLP (Micro Leaded Package) outline, this new 4th generation low saturation transistor offers extremely low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions. Additionally users will also gain several other key benefits:
Performance capability equivalent to much larger packages
Improved circuit efficiency & power levels
Lower package height (nom 0.9mm)
PCB area and device placement savings
Reduced component count
FEATURES • Low Equivalent On Resistance • Extremely Low Saturation Voltage (100mV max @1A)
• hFE specified up to 6A • IC= 4A Continuous Collector Current • 2mm x 2mm MLP
APPLICATIONS • DC - DC Converters • Charging Circuits • Power switches • Motor control ORDERING INFORMATION
DEVICE
ZXTCM322TA ZXTCM322TC
REEL
7 13
TAPE WIDTH
8mm
8mm
QUANTITY PER REEL
3000
10000
DEVICE MARKING
SC
ISSUE 2 - JUNE 2002
1
ZXTCM322
2mm x 2mm MLP (single die)
PINOUT
2mm x 2mm Single MLP underside view
ZXTCM322
ABSOLUTE MAXIMUM RATINGS.
PARAMETER Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Peak Pulse Current (c) Continuous Collector Current (a) Base Current Power Dissipation at TA=25°C (a) Linear Derating Factor Power Dissipation at TA=25°C (b) Linear Derating Factor Power Dissipation at TA=25°C (d) Linear Derating Factor Power Dissipation at TA=25°C (e) Linear Derating Factor Operating and Storage Temperature Range
SYMBOL VCBO VCEO VEBO ICM IC IB PD
PD
PD
PD
Tj:Tstg
LIMIT 100 50 7.5
6 4 1000 1.5 12
2.45 19.6
1 8
3 24
-55 to +150
UNIT V V V A A mA W
mW/°C
W mW/°C
W mW/°C
W mW/°C
°C
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a) Junction to Ambient (b) Junction to Ambient (d) Junction to Ambient (e)
RθJA RθJA RθJA RθJA
83 51 125 42
°C/W °C/W °C/W °C/W
NOTES (a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at tр5 secs with all exposed pads attached.
(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph. (d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only.
(e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(f) The minimum copper dimensions requires for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and 1mm wide wide tracks is Rth=300ЊC giving a power rating of Ptot=420mW.
ISSUE 2 - JUNE 2002 2
IC Coll.