Document
P6SMB Series
TVS Diodes
Surface Mount – 600W > P6SMB series
RoHS
Pb e3
Uni-directional
Bi-directional
Agency Approvals
Agency
Agency File Number E230531
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)
Parameter
Symbol Value Unit
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1),(Note 2) -Single Die Parts
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note.1, Note.2)-Stacked Die Parts
(Note.5)
PPPM PPPM
600 W 800 W
Power Dissipation on Infinite Heat Sink at TL=50OC
PD
Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3)
IFSM
Maximum Instantaneous Forward Voltage at 50A for Unidirectional Only (Note 4)
VF
5.0
W
100
A
3.5/5.0 V
Operating Temperature Range Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient
TJ -65 to 150 °C
TSTG -65 to 175 °C
RƟJL
20 °C/W
RƟJA
100 °C/W
Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics.
Description
The P6SMB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Features
• 600W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• Excellent clamping capability
• Low incremental surge resistance
• Typical IR less than 1μA when VBR min>12V
• Optimized surface mount footprint for minimal PCB space impact
• Low profile package
• Typical failure mode due to exceeding maximum ratings is a short circuit condition
• Whisker test conducted based on Table 4a and 4c of JEDEC JESD201A
• IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)
• EFT protection of data lines in accordance with IEC 61000-4-4
• Built-in strain relief
• Fast response time: typically less than 1.0ps from 0V to VBR min
• High temperature to reflow soldering guaranteed: 260°C/30sec
• VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
• UL Recognized compound meeting flammability classification V-0
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2ND level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01)
• UL Recognized to ANSI/UL 497B: Protectors for Data Communications and FireAlarm Circuits.
Applications
TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer,.