HEXFET Power MOSFET
VDS Vgs max RDS(on) max
(@VGS = 10V) (@VGS = 4.5V)
Qg typ.
ID
(@Tc(Bottom) = 25°C)
30 ± 20 4.9
6.8 19.4
25i
V V
m
nC ...
Description
VDS Vgs max RDS(on) max
(@VGS = 10V) (@VGS = 4.5V)
Qg typ.
ID
(@Tc(Bottom) = 25°C)
30 ± 20 4.9
6.8 19.4
25i
V V
m
nC A
Applications
Synchronous MOSFET for high frequency buck converters
IRFH8321PbF
HEXFET® Power MOSFET
PQFN 5X6 mm
Features Low Thermal Resistance to PCB (< 2.3°C/W) Low Profile (<1.2mm)
Industry-Standard Pinout Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Consumer Qualification
results in
Benefits Enable better thermal dissipation Increased Power Density
Multi-Vendor Compatibility Easier Manufacturing
Environmentally Friendlier Increased Reliability
Orderable part number IRFH8321TRPBF
Package Type PQFN 5mm x 6mm
Standard Pack
Form
Quantity
Tape and Reel
4000
Note
Absolute Max imum Ratings
Pa ram ete r
VGS Gate-to-Source Voltage
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TA = 70°C
Continuous Drain Current, VGS @ 10V
ID @ TC (Bottom) = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC(Bottom) = 100°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 25°C
ID M PD @TA = 25°C PD @TC (Bottom) = 25°C
Continuous Drain Current, VGS @ 10V (Source Bonding Technology Limited)
cPulsed Drain Current gPower Dissipation gPower Dissipation gLinear Derating Factor
TJ Operating Junction and
TSTG
Storage Temperature Range
Max. ± 20 21 17
83hi 52hi 25i
332 3.4 54 0.027 -55 to + 150
Units V
A
W W /°C
°C
Notes through are on page 9 1 www.irf.com © 2012 Internati...
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