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PMPB19XP Dataheets PDF



Part Number PMPB19XP
Manufacturers NXP
Logo NXP
Description single P-channel Trench MOSFET
Datasheet PMPB19XP DatasheetPMPB19XP Datasheet (PDF)

PMPB19XP 20 V, single P-channel Trench MOSFET 20 September 2012 Product data sheet 1. Product profile 1.1 General description P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 1.2 Features and benefits • Trench MOSFET technology • Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm • Exposed drain pad for excellent thermal conduction • Tin-plated.

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PMPB19XP 20 V, single P-channel Trench MOSFET 20 September 2012 Product data sheet 1. Product profile 1.1 General description P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 1.2 Features and benefits • Trench MOSFET technology • Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm • Exposed drain pad for excellent thermal conduction • Tin-plated 100 % solderable side pads for optical solder inspection 1.3 Applications • Charging switch for portable devices • DC-to-DC converters • Power management in battery-driven portable devices • Hard disk and computing power management 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj = 25 °C - - -20 V VGS gate-source voltage -12 - 12 V ID drain current VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s [1] - - -10.3 A Static characteristics RDSon drain-source on-state VGS = -4.5 V; ID = -7.2 A; Tj = 25 °C resistance - 19 22.5 mΩ [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm2. Scan or click this QR code to view the latest information for this product NXP Semiconductors PMPB19XP 20 V, single P-channel Trench MOSFET 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 D drain 2 D drain 3 G gate 4 S source 5 D drain 6 D drain 7 D drain 8 S source Simplified outline 16 7 25 Graphic symbol D G 384 Transparent top view DFN2020MD-6 (SOT1220) S 017aaa257 3. Ordering information Table 3. Ordering information Type number Package Name Description PMPB19XP DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals Version SOT1220 4. Marking Table 4. Marking codes Type number PMPB19XP Marking code 1R 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDS drain-source voltage Tj = 25 °C VGS gate-source voltage ID drain current VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s VGS = -4.5 V; Tamb = 25 °C VGS = -4.5 V; Tamb = 100 °C IDM peak drain current Tamb = 25 °C; single pulse; tp ≤ 10 µs Ptot total power dissipation Tamb = 25 °C PMPB19XP All information provided in this document is subject to legal disclaimers. Product data sheet 20 September 2012 [1] [1] [1] [1] Min Max Unit - -20 V -12 12 V - -10.3 A - -7.2 A - -4.5 A - -30 A - 1.7 W © NXP B.V. 2012. All rights reserved 2 / 14 NXP Semiconductors PMPB19XP 20 V, single P-channel Trench MOSFET Symbol Parameter Tj junction temperature Tamb ambient temperature Tstg storage temperature Source-drain diode IS source current Conditions Tamb = 25 °C; t ≤ 5 s Tsp = 25 °C Tamb = 25 °C Min Max Unit [1] - 3.5 W - 12.5 W -55 150 °C -55 150 °C -65 150 °C [1] - -1.9 A [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm2. 120 017aaa123 120 017aaa124 Pder (%) Ider (%) 80 80 40 40 0 - 75 - 25 25 75 125 175 Tj (°C) Fig. 1. Normalized total power dissipation as a function of junction temperature 0 - 75 - 25 25 75 125 175 Tj (°C) Fig. 2. Normalized continuous drain current as a function of junction temperature PMPB19XP Product data sheet All information provided in this document is subject to legal disclaimers. 20 September 2012 © NXP B.V. 2012. All rights reserved 3 / 14 NXP Semiconductors PMPB19XP 20 V, single P-channel Trench MOSFET -102 ID (A) -10 -1 -10-1 Limit RDSon = VDS/ID DC; Tsp = 25 °C DC; Tamb = 25 °C; drain mounting pad 6 cm2 017aaa749 tp = 100 µs tp = 1 ms tp = 10 ms tp = 100 ms -10-2 -10-2 IDM = single pulse -10-1 -1 -10 -102 VDS (V) Fig. 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drainsource voltage 6. Thermal characteristics Table 6. Symbol Rth(j-a) Rth(j-sp) Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air in free air; t ≤ 5 s thermal resistance from junction to solder point Min Typ Max Unit [1] - 235 270 K/W [2] - 67 74 K/W [2] - 33 36 K/W - 5 10 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2. PMPB19XP Product data sheet All information provided in this document is subject to legal disclaimers. 20 September 2012 © NXP B.V. 2012. All rights reserved 4 / 14 NXP Semiconductors PMPB19XP 20 V, single P-channel Trench MOSFET 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 0.01 0 017aaa542 1 10-3 10-2 FR4 PCB, standard footprint 10-1 1 10 102 103 tp (s) Fig. 4. Transient thermal impedance from junction to ambient as a function of pul.


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