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SESD7L Dataheets PDF



Part Number SESD7L
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description ESD Protection Diode
Datasheet SESD7L DatasheetSESD7L Datasheet (PDF)

ESD7L, SESD7L ESD Protection Diode Ultra−Low Capacitance The ESD7L Series is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping capability, low leakage and fast response time are combined with an ultra low diode capacitance of 0.5 pF to provide best in class protection from IC damage due to ESD. The ultra small SOT−723 package is ideal for designs where board space is at a p.

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ESD7L, SESD7L ESD Protection Diode Ultra−Low Capacitance The ESD7L Series is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping capability, low leakage and fast response time are combined with an ultra low diode capacitance of 0.5 pF to provide best in class protection from IC damage due to ESD. The ultra small SOT−723 package is ideal for designs where board space is at a premium. The ESD7L Series can be used to protect two uni−directional lines or one bi−directional line. When used to protect one bi−directional line, the effective capacitance is 0.25 pF. Because of its low capacitance, it is well suited for protecting high frequency signal lines such as USB2.0 high speed and antenna line applications. Specification Features: • Low Capacitance 0.5 pF Typical • Low Clamping Voltage • Small Body Outline Dimensions: 0.047” x 0.047” (1.20 mm x 1.20 mm) • Low Body Height: 0.020″ (0.5 mm) • Stand−off Voltage: 5 V • Low Leakage • Response Time is Typically < 1.0 ns • IEC61000−4−2 Level 4 ESD Protection • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • This is a Pb−Free Device Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Storage Temperature Range Junction Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° Tstg TJ TL ±10 kV 150 mW −55 to +150 °C −55 to +150 °C 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. © Semiconductor Components Industries, LLC, 2012 1 November, 2017 − Rev. 7 www.onsemi.com PIN 1. CATHODE 1 2. CATHODE 3 3. ANODE 2 SCALE 4:1 SOT−723 CASE 631AA MARKING DIAGRAM L6 M 1 L6 = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping† ESD7L5.0DT5G SOT−723 8000/Tape & Reel (Pb−Free) SESD7L5.0DT5G SOT−723 8000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. See Application Note AND8308/D for further description of survivability specs. Publication Order Number: ESD7L/D ESD7L, SESD7L ELECTRICAL CHARACTERISTICS (TA = 25°C.


ESD7L SESD7L SESD7L5.0DT5G


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