Document
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
e·MMC™ Memory
MTFC2GMVEA-0M WT, MTFC4GLVEA-0M WT, MTFC4GMVEA-1M WT, MTFC8GLVEA-1M WT, MTFC16GJVEC-2M WT, MTFC32GJVED-3M WT, MTFC64GJVDN-3M WT
Features
• MultiMediaCard (MMC) controller and NAND Flash • 153- or 169-ball WFBGA/VFBGA/LFBGA (RoHS 6/6-
compliant) • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Temperature ranges
– Operating temperature: –25˚C to +85˚C – Storage temperature: –40˚C to +85˚C • Typical current consumption – Standby current: 110µA for 2GB, 120µA for 4GB,
8GB, 16GB; 140µA for 32G; 160µA for 64GB – Active current (RMS): 70mA (2GB); 80mA (4GB,
8GB, 16GB, 32GB, 64GB)
MMC-Specific Features
• JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) – SPI mode not supported (see www.jedec.org/sites/default/files/ docs/JESD84-A441.pdf) – Advanced 11-signal interface – x1, x4, and x8 I/Os, selectable by host – MMC mode operation – Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) – MMCplus™ and MMCmobile™ protocols – Temporary write protection – 52 MHz clock speed (MAX) – Boot operation (high-speed boot) – Sleep mode – Replay-protected memory block (RPMB) – Secure erase and trim – Hardware reset signal – Multiple partitions with enhanced attribute – Permanent and power-on write protection – Double data rate (DDR) function – High-priority interrupt (HPI)
Figure 1: Micron e·MMC Device
MMC power
MMC controller
MMC interface
NAND Flash power
NAND Flash
MMC-Specific Features (Continued) – Enhanced reliable write – Configurable reliability settings – Background operation – Fully enhanced configurable – Backward-compatible with previous MMC modes
• ECC and block management implemented
PDF: 09005aef84d69f8a emmc_2gb_4gb_8gb_16gb_32gb_64gb-wt.pdf - Rev. A 6/12 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
e·MMC Performance
Table 1: MLC Partition Performance
Condition Sequential write Sequential read
MTFC2GMVEA-0M WT MTFC4GLVEA-0M WT
6.6
30
Part Number
MTFC4GMVEA-1M WT MTFC8GLVEA-1M WT
13.5 44
MTFC16GJVEC-2M WT MTFC32GJVED-3M WT MTFC64GJVDN-3M WT
20
44
Units MB/s MB/s
Note: 1. Random access of 4KB chunk; sequential read access of 1MB chunk. Additional performance data, such as power consumption or timing for different device modes, will be provided in a separate document upon customer request.
Ordering Information
Table 2: Ordering Information
Base Part Number Density MTFC2GMVEA-0M WT 2GB
MTFC4GLVEA-0M WT
4GB
MTFC4GMVEA-1M WT 4GB
MTFC8GLVEA-1M WT
8GB
MTFC16GJVEC-2M WT 16GB
MTFC32GJVED-3M WT 32GB
MTFC64GJVDN-3M WT 64GB
Package 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
169-ball WFBGA 14.0mm x 18.0mm x 0.8mm
169-ball VFBGA 14.0mm x 18.0mm x 1.0mm
169-ball LFBGA 14.0mm x 18.0mm x 1.4mm
NAND Flash Type
1 x 16Gb, MLC, 25nm
1 x 32Gb, MLC, 25nm
2 x 16Gb, MLC, 25nm
2 x 32Gb, MLC, 25nm
2 x 64Gb, MLC, 25nm
4 x 64Gb, MLC, 25nm
8 x 64Gb, MLC, 25nm
Shipping Media Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel
PDF: 09005aef84d69f8a emmc_2gb_4gb_8gb_16gb_32gb_64gb-wt.pdf - Rev. A 6/12 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2012 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
Part Numbering Information
Micron®e·MMC memory devices are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found.
Figure 2: Marketing Part Number Chart MT FC 2G M V x EA - 0 M WT
Micron Technology
Product Family
FC = NAND Flash + controller
Production Status
Blank = Production ES = Engineering samples MS = Mechanical samples
NAND Flash Density
2G = 2GB 4G = 4GB 8G = 8GB 16G = 16GB 32G = 32GB 64G = 64GB
NAND Flash Component
Mark Device J MLC 64Gb, x8, 3.3V (25nm) L MLC 32Gb, x8, 3.3V (25nm) M MLC 16Gb, x8, 3.3V (25nm)
Controller Revision
Mark (Rev.) Controller ID T Enhanced V Combo
Operating Temperature Range Blank = 0°C to 70°C WT = Standard (–25°C to +85°C) IT = Extended (–40°C to +85)°C
SLC Enhanced Area
F = 40% M = 100%
Maximum Boot Size
0 = 1MB 1 = 2MB 2 = 4MB 3 = 8MB 4 = 16MB
Package Codes (Pb-free)
DN = 169 LFBGA 14mm x 18mm x 1.4mm DQ = 100 LFBGA 14mm x 18mm x 1.4mm EA = 15.