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MTFC8GLVEA-1M-WT Dataheets PDF



Part Number MTFC8GLVEA-1M-WT
Manufacturers Micron
Logo Micron
Description e-MMC Memory
Datasheet MTFC8GLVEA-1M-WT DatasheetMTFC8GLVEA-1M-WT Datasheet (PDF)

Micron Confidential and Proprietary 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features e·MMC™ Memory MTFC2GMVEA-0M WT, MTFC4GLVEA-0M WT, MTFC4GMVEA-1M WT, MTFC8GLVEA-1M WT, MTFC16GJVEC-2M WT, MTFC32GJVED-3M WT, MTFC64GJVDN-3M WT Features • MultiMediaCard (MMC) controller and NAND Flash • 153- or 169-ball WFBGA/VFBGA/LFBGA (RoHS 6/6- compliant) • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Temperature ranges – Operating temperature: –25˚C to +85˚C – Storage temperature: –40˚C to +8.

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Micron Confidential and Proprietary 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features e·MMC™ Memory MTFC2GMVEA-0M WT, MTFC4GLVEA-0M WT, MTFC4GMVEA-1M WT, MTFC8GLVEA-1M WT, MTFC16GJVEC-2M WT, MTFC32GJVED-3M WT, MTFC64GJVDN-3M WT Features • MultiMediaCard (MMC) controller and NAND Flash • 153- or 169-ball WFBGA/VFBGA/LFBGA (RoHS 6/6- compliant) • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Temperature ranges – Operating temperature: –25˚C to +85˚C – Storage temperature: –40˚C to +85˚C • Typical current consumption – Standby current: 110µA for 2GB, 120µA for 4GB, 8GB, 16GB; 140µA for 32G; 160µA for 64GB – Active current (RMS): 70mA (2GB); 80mA (4GB, 8GB, 16GB, 32GB, 64GB) MMC-Specific Features • JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) – SPI mode not supported (see www.jedec.org/sites/default/files/ docs/JESD84-A441.pdf) – Advanced 11-signal interface – x1, x4, and x8 I/Os, selectable by host – MMC mode operation – Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) – MMCplus™ and MMCmobile™ protocols – Temporary write protection – 52 MHz clock speed (MAX) – Boot operation (high-speed boot) – Sleep mode – Replay-protected memory block (RPMB) – Secure erase and trim – Hardware reset signal – Multiple partitions with enhanced attribute – Permanent and power-on write protection – Double data rate (DDR) function – High-priority interrupt (HPI) Figure 1: Micron e·MMC Device MMC power MMC controller MMC interface NAND Flash power NAND Flash MMC-Specific Features (Continued) – Enhanced reliable write – Configurable reliability settings – Background operation – Fully enhanced configurable – Backward-compatible with previous MMC modes • ECC and block management implemented PDF: 09005aef84d69f8a emmc_2gb_4gb_8gb_16gb_32gb_64gb-wt.pdf - Rev. A 6/12 EN 1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2012 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Micron Confidential and Proprietary 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features e·MMC Performance Table 1: MLC Partition Performance Condition Sequential write Sequential read MTFC2GMVEA-0M WT MTFC4GLVEA-0M WT 6.6 30 Part Number MTFC4GMVEA-1M WT MTFC8GLVEA-1M WT 13.5 44 MTFC16GJVEC-2M WT MTFC32GJVED-3M WT MTFC64GJVDN-3M WT 20 44 Units MB/s MB/s Note: 1. Random access of 4KB chunk; sequential read access of 1MB chunk. Additional performance data, such as power consumption or timing for different device modes, will be provided in a separate document upon customer request. Ordering Information Table 2: Ordering Information Base Part Number Density MTFC2GMVEA-0M WT 2GB MTFC4GLVEA-0M WT 4GB MTFC4GMVEA-1M WT 4GB MTFC8GLVEA-1M WT 8GB MTFC16GJVEC-2M WT 16GB MTFC32GJVED-3M WT 32GB MTFC64GJVDN-3M WT 64GB Package 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm 169-ball WFBGA 14.0mm x 18.0mm x 0.8mm 169-ball VFBGA 14.0mm x 18.0mm x 1.0mm 169-ball LFBGA 14.0mm x 18.0mm x 1.4mm NAND Flash Type 1 x 16Gb, MLC, 25nm 1 x 32Gb, MLC, 25nm 2 x 16Gb, MLC, 25nm 2 x 32Gb, MLC, 25nm 2 x 64Gb, MLC, 25nm 4 x 64Gb, MLC, 25nm 8 x 64Gb, MLC, 25nm Shipping Media Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel Tray Tape and reel PDF: 09005aef84d69f8a emmc_2gb_4gb_8gb_16gb_32gb_64gb-wt.pdf - Rev. A 6/12 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2012 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features Part Numbering Information Micron®e·MMC memory devices are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found. Figure 2: Marketing Part Number Chart MT FC 2G M V x EA - 0 M WT Micron Technology Product Family FC = NAND Flash + controller Production Status Blank = Production ES = Engineering samples MS = Mechanical samples NAND Flash Density 2G = 2GB 4G = 4GB 8G = 8GB 16G = 16GB 32G = 32GB 64G = 64GB NAND Flash Component Mark Device J MLC 64Gb, x8, 3.3V (25nm) L MLC 32Gb, x8, 3.3V (25nm) M MLC 16Gb, x8, 3.3V (25nm) Controller Revision Mark (Rev.) Controller ID T Enhanced V Combo Operating Temperature Range Blank = 0°C to 70°C WT = Standard (–25°C to +85°C) IT = Extended (–40°C to +85)°C SLC Enhanced Area F = 40% M = 100% Maximum Boot Size 0 = 1MB 1 = 2MB 2 = 4MB 3 = 8MB 4 = 16MB Package Codes (Pb-free) DN = 169 LFBGA 14mm x 18mm x 1.4mm DQ = 100 LFBGA 14mm x 18mm x 1.4mm EA = 15.


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