N-CHANNEL PowerMESH MOSFET
STP3NB100
STP3NB100FP
N-CHANNEL 1000V - 5.3Ω - 3A TO-220/TO-220FP PowerMesh™ MOSFET
TYPE
VDSS
RDS(on)
ID
PRELIMIN...
Description
STP3NB100
STP3NB100FP
N-CHANNEL 1000V - 5.3Ω - 3A TO-220/TO-220FP PowerMesh™ MOSFET
TYPE
VDSS
RDS(on)
ID
PRELIMINARY DATA
STP3NB100
1000 V
<6Ω
3A
STP3NB100FP
1000 V
<6Ω
3A
s TYPICAL RDS(on) = 5.3Ω
s EXTREMELY HIGH dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s VERY LOW INTRINSIC CAPACITANCES s GATE CHARGE MINIMIZED
3 2 1
3 2 1
)DESCRIPTION t(sUsing the latest high voltage MESH OVERLAY™
process, STMicroelectronics has designed an ad-
cvanced family of power MOSFETs with outstanding uperformances. The new patent pending strip layout rodcoupled with the Company’s proprieraty edge termi-
nation structure, gives the lowest RDS(on) per area,
Pexceptional avalanche and dv/dt capabilities and teunrivalled gate charge and switching characteris-
tics.
oleAPPLICATIONS ss HIGH CURRENT, HIGH SPEED SWITCHING bs SWITH MODE POWER SUPPLIES (SMPS) Os DC-AC CONVERTERS FOR WELDING -EQUIPMENT
t(s)ABSOLUTE MAXIMUM RATINGS
cSymbol
Parameter
roduVDS PVDGR teVGS leID soID ObIDM (v)
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C Drain Current (pulsed)
TO-220
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
Value STP3NB100 STP3NB100FP
1000 1000 ±30 3 3 (*) 1.9 1.9 (*) 12 12
Unit
V V V A A A
PTOT
Total Dissipation at TC = 25°C
100 35 W
Derating Factor
0.8
0.28
W/°C
dv/dt (1) Peak Diode Recovery voltage slope
4.5 4.5 V/ns
VISO
Insulation Withstand Voltage (DC)
-
...
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