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TCS10SLU Dataheets PDF



Part Number TCS10SLU
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description Digital-Output Magnetic Sensor
Datasheet TCS10SLU DatasheetTCS10SLU Datasheet (PDF)

TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TCS10SLU TCS10SLU Digital Output Magnetic Sensor Feature Open-Drain Output South-Pole Detection UFV Weight: 0.007 g (typ.) Marking LA1 Pin Assignment (Top View) VCC (Note 1) GND2 (Note 2) 54 1 23 VOUT GND1 NC (Note 2) Function Table Magnetic Flux Density ≥ BON ≤ BOFF Output L Z (Note 3) Note 1: It is recommended to add a capacitor of about 0.1 μF between VCC and GND. Note 2: The GND1 and GND2 pins should be tied to ground. The G.

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TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TCS10SLU TCS10SLU Digital Output Magnetic Sensor Feature Open-Drain Output South-Pole Detection UFV Weight: 0.007 g (typ.) Marking LA1 Pin Assignment (Top View) VCC (Note 1) GND2 (Note 2) 54 1 23 VOUT GND1 NC (Note 2) Function Table Magnetic Flux Density ≥ BON ≤ BOFF Output L Z (Note 3) Note 1: It is recommended to add a capacitor of about 0.1 μF between VCC and GND. Note 2: The GND1 and GND2 pins should be tied to ground. The GND2 pin is used as a test pin during production. Note 3: In the high-impedance state. 1 2010-02-01 Absolute Maximum Ratings (Ta = 25°C) TCS10SLU Characteristics Symbol Rating Unit Supply Voltage Output Voltage Output Diode Current Output Current VCC/GND Current Power Dissipation Storage Temperature Range VCC VOUT IOK IOUT ICC PD Tstg −0.5 to 6.0 −0.5 to 6.0 -10 5 ±10 200 −65 to 150 V V mA mA mA mW °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Operating Ranges Characteristics Symbol Rating Supply Voltage VCC 2.3 to 3.6 Output Voltage VOUT 0 to 5.5 (Note 4) Output Current IOL 1.0 Operating Temperature Topr −40 to 85 Note 4: VCC = 0.0 V or when the output is in the high-impedance state. Unit V V mA °C 2 2010-02-01 TCS10SLU DC Characteristics (Ta = 25°C) Characteristics Symbol Condition VCC (V) Output Voltage Low- Level VOL IOL = 1.0 mA 2.3 to 3.6 Output Leakage Current Supply Current Average Current IOFF ICC VOUT = 5.5V Current at pulse driving (Note 5, Fig. A) 0 2.3 to 2.7 3.0 to 3.6 Operating Current ICC ON Peak current (Note 5, Fig. A) 2.3 to 3.6 Operating Frequency fopr (Fig. A) 2.3 to 3.6 Note 5: Supply Current is pulsed periodically by internal circuit. Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Typ. Max ⎯ VCC x 10% 0.5 1 5.5 9.5 8.7 13.2 Unit V μA μA 0.7 1.3 25 ⎯ mA Hz Magnetic Characteristics (Ta = 25°C) Characteristics Symbol Condition (Note 6, Fig. B) VCC (V) Magnetic Flux Density Operating Point Releasing Point BON BOFF VOUT = VOL VOUT = Z (Note 7) 2.3 to 3.6 2.3 to 3.6 Hysteresis BH |BON - BOFF| 2.3 to 3.6 Note 6: Uniform magnetic field perpendicularly to the magnetic sensor. Note 7: In the high-impedance state. Min ⎯ 0.3 ⎯ Note: Direction of the Magnetic field Typ. Max 1.8 2.5 0.8 ⎯ 1.0 ⎯ Unit mT Magnetic Field, B (Fig. A): ICC Characteristics ICC Operating Current (typ. 0.7 mA) 1/fopr(fopr = 25 Hz) Average Current (typ. 5.5 μA) Time (Fig. B): Operating Characteristics VOUT High-impedance state VOL North-Pole 0 3 BH BOFF BON Magnetic Flux Density South-Pole 2010-02-01 Package Dimensions TCS10SLU 2.0±0.1 Weight: 0.007 g (typ.) 4 2010-02-01 Layout of Magnetic Detection Part 0.85 Sensor Element (0.2 mm2) TCS10SLU Unit: mm Sensor Element 1.05 0.3 Note: Dimensional tolerances are ±0.1mm, unless otherwise specified. 5 2010-02-01 TCS10SLU RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their o.


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