MPXC2011DT1

Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXC2011DT1 Rev. 11, 09/2015 MPXC2011DT1, 0 to 10 kPa, Differential, Compensated Pressure Sensor Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Features Integrated temperature compensation and calibration Ratiometric to supply voltage Polysulfone case material (ISO 10993) Provided in easy-to-use tape and reel Typical applications Respiratory diagnostics Air movement control Controllers Pressure switching NOTE The die and wire bonds are exposed on the ...