MPXC12DT1

Freescale Semiconductor Pressure MPXC12DT1 Rev 0, 11/2010 10 kPa Uncompensated Silicon Pressure Sensor MPXC12DT1 Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of Freescale’s single element strain gauge design. Features Low Cost Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel Patented Silicon Shear Stress Strain Gauge Design Pressure Sensor 55 mV Full Scale Span (Typical) 0 to 10 kPa Application Examples Respiratory Diagnostics Device Name MPXC12DTI Package Options Tape and Reel ORDERING INFORMATION Case No. Gauge Pressure Type Differential 423A Absolute Device Marking Date Code, Lot ID CHIP PAK PACKAGE MPXC12DT1 CASE 423A NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. © Freescale Semiconductor, Inc., 2010. All rights reserved...