QFN-24

Packaging Information / Reference Pattern Layout Dimensions ●QFN-24 ■Packaging Information 1 PIN INDENT Unit: mm 4.0±0.10 0.075 7 8 9 10 11 12 0.40±0.05 6 13 5 14 4 15 3 16 2 17 1 18 24 23 22 21 20 19 ■Reference Pattern Layout Dimensions 2.8±0.05 Note : reference metal mask design 0.50 0.50 1.10 2.50 4.50 3.30 0.30 2.70 4.60 3.20 1.10 0.25 Taping Specifications ●QFN-24 Reel Unit: mm 0.8 0.6 0.4 0.2 60±0.5 178.0±0.5 0.8 0.6 0.4 0.2 ●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed 1.75±0.1 5.5±0.05 (4.35) 12.0±0.3 direction of feed L Type :[Device orientation : Left] Reverse feed ● QFN-24 Power Dissipation Power dissipation data for the QFN-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% connected to the package heat-sink. Material: Glass Epoxy (FR-4) Thickness: 1.0 mm Through-hole: 4 x 0.4 Diameter 40.0 2.5 28.9 Power DissipationPdP（dm(Wm）W) 2.54 28.9 1.4 40.0 2. Power Dissipation vs. Ambient Temperature Ambient Temperature（℃） Power Dissipation Pd（mW） 25 1500 85 600 Thermal Resistance(℃/W) 66.67 1600 1400 1200 1000 800 600 400 200 0 25 Pd-TPadvs....