Hexfred Die
PD - 94412A
HF05D060ACE
Features
GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery
Benefit...
Description
PD - 94412A
HF05D060ACE
Features
GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery
Benefits
Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation Qualified for Industrial Market
Hexfred Die in Wafer Form 600V
IF(nom)=5A VF(typ)= 1.15V @ IF(nom) @ 25°C Motor Control Antiparallel Diode
150mm Wafer
Reference Standard IR Package Part: IRGS10B60KD
Parameter
Electrical Characteristics (Wafer Form)
Description
Guaranteed (min, max)
Test Conditions
VF Forward Voltage Drop BVR Reverse Breakdown Voltage IRM Reverse Leakage Current
0.8V min, 1.05V max 600V min 10µA max
IC = 1A, TJ = 25°C TJ = 25°C, IR = 1mA TJ = 25°C, VR = 600V
Mechanical Data
Nominal Backmetal Composition, (Thickness)
Cr (0.1µm)- NiV (0.2µm) - Ag (0.25µm)
Nominal Front Metal Composition, (Thickness)
99% Al/1% Si, (3µm)
Dimensions
0.075'' x 0.076"
Wafer Diameter
150mm, with std. < 100 > flat
Wafer Thickness, Tolerance
376µm, +/-15µm
Relevant Die Mechanical Dwg. Number
01-5507
Minimum Street Width
125µm
Reject Ink Dot Size
0.25mm diameter minimum
Ink Dot Location
Consistent throughout same wafer lot
Recommended Storage Environment
Store in original container, in dessicated
nitrogen, with no contamination
Recommended Die Attach Conditions
For optimum electrical results, die attach
temperature should not exceed 300°C
Die Outline
www.irf.com
1 07/01/04
100 0
-100 -2...
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