4M-Word x 9-Bit DRAM MODULE
E2H0093-15-90
¡¡SemicondSucetormiconductor
TMhSisCv2e3rs4i0o9nC: /SCeLp-.x1x9D95S9
MSC23409C/CL-xxDS9
4,194,304-Word...
Description
E2H0093-15-90
¡¡SemicondSucetormiconductor
TMhSisCv2e3rs4i0o9nC: /SCeLp-.x1x9D95S9
MSC23409C/CL-xxDS9
4,194,304-Word ¥ 9-Bit DRAM MODULE : FAST PAGE MODE TYPE
DESCRIPTION
The OKI MSC23409C/CL-xxDS9 is a fully decoded 4,194,304-word ¥ 9-bit CMOS Dynamic Random Access Memory Module composed of nine 4-Mb DRAMs (4M ¥ 1) in SOJ packages mounted with nine decoupling capacitors on a 30-pin glass epoxy single-inline package. This module is generally used for memory expansion in parity applications such as workstations. The low-power version (CL) offers reduced power consumption for mobile computing applications like laptops and palmtops.
FEATURES
4-Meg ¥ 9-bit organization 30-Pin Socket Insertable Module
MSC23409C/CL-xxDS9 : Solder tab Single 5 V supply ±10% tolerance Access times : 60, 70, 80 ns Input : TTL compatible Output : TTL compatible, 3-state Refresh : 1024 cycles/16 ms (128 ms : L-version) CAS before RAS refresh, CAS before RAS hidden refresh, RAS-only refresh capability Multi-bit test mode capability Fast Page Mode capability
PRODUCT FAMILY
Family
MSC23409C/CL-60DS9 MSC23409C/CL-70DS9 MSC23409C/CL-80DS9
Access Time (Max.)
tRAC 60 ns
tAA 30 ns
tCAC 15 ns
70 ns 35 ns 20 ns
80 ns 40 ns 20 ns
Cycle Time
Power Dissipation
(Min.) Operating (Max.) Standby (Max.)
110 ns 130 ns 150 ns
4950 mW 4455 mW 3960 mW
49.5 mW/ 9.9 mW (L-version)
1/13
¡ Semiconductor
MSC23409C/CL-xxDS9
PIN CONFIGURATION MSC23409C/CL-xxDS9
3.38 Tpy.
*1 88.9 ±0.2 82....
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