BL2012-10B5388

BL 2012 Series Multilayer Chip Baluns Features  Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications ACX Advanced Ceramic X Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B5388_ 4900~ 5875 Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity Part Number 50 100 : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 12 months max. : 2W max. 1.0 max. 2.0 max. 180  10 2 max. BL 2012 - 10 B   5388  /LF    Type BL : Balun  Dimensions ( L × W )  Balanced Impedance 10 : 100 ohm  Specification Code 2.0 × 1.25 mm B  Central Frequency  Soldering 5388 : 5388MHz  Packaging =lead-containing /LF=lead-free T: Tape & Reel B: Bulk Terminal Configuration       No. Terminal Name No.  Unbalanced Port (IN)   GND or DC feed + RF GND   Balanced Port (OUT1)  Terminal Name Balanced Port (OUT2) GND NC BL2012-10B5388T/LF REV:2 PAGE:1/7 Dimensions and Recommended PC Board Pattern a p ACX Advanced Ceramic X Unit : mm Mark Dimensions W T c L gb L 2.0  0.1 W 1.25  0.1 T 0.95  0.1 a 0.3  0.1 b 0.2  0.1 c 0.3+0.1 /-0.2 g 0.35  0.1 p 0.65  0.05 Without DC feed 0.35 * 0.8 * 1.0 * With DC f...