BL2012-10B5512

BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B5512_ 5150 ~ 5875 50 100 1.0 max. 2.0 max. 180 ± 10 2 max. Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Power Capacity : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 3W max. Part Number BL 2012 - 10 B c d ef 5512 ‡ gh /LF i c Type BL : Balun d Dimensions ( L × W ) 2.0 × 1.25 mm e Balanced Impedance 10 : 100 ohm f Specification Code B g Central Frequency i Soldering 5512 : 5512MHz h Packaging lead-containing /LF=lead-free T: Tape & Reel B: Bulk Terminal Configuration edc fgh No. Terminal Name No. c Unbalanced Port (IN) f d GND or DC feed g e Balanced Port (OUT1) h Terminal Name Balanced Port (OUT2) GND NC Dimensions and Recommended PC Board Pattern a p ACX Advanced Ceramic X Unit : mm Mark Dimensions L L 2.0 ± 0.1 W c W 1.25 ± 0.1 T 0.85 ± 0.1 T gb a 0.3 ± 0.1 b 0.2 ± 0.1 c 0.3+0.1 /-0.2 g 0.35 ± 0.1 p 0.65 ± 0.05 Without DC feed 0.65 0.35 * * 0.2 1.0 0.8 * 0.25 With DC feed 0.65 0.3 0.35 * Solder Resist Land Through-hole (φ * 0.2 1.0 0...