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EMI9404 Dataheets PDF



Part Number EMI9404
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description 4-Channel EMI Array
Datasheet EMI9404 DatasheetEMI9404 Datasheet (PDF)

EMI9404 PRAETORIAN) III 4-Channel EMI Array with ESD Protection Description The EMI9404 is an inductor−based (L−C) EMI filter array with ESD protection, which integrates four filters in a UDFN package with 0.40 mm pitch. Each EMI filter channel of the EMI9404 is implemented with the component value of 1.8 pF−35 nH–4.7 pF−35 nH– 6 pF. The cut−off frequency at −3 dB attenuation is 300 MHz and can be used in applications where the data rates are as high as 160 Mbps, while providing greater than −3.

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EMI9404 PRAETORIAN) III 4-Channel EMI Array with ESD Protection Description The EMI9404 is an inductor−based (L−C) EMI filter array with ESD protection, which integrates four filters in a UDFN package with 0.40 mm pitch. Each EMI filter channel of the EMI9404 is implemented with the component value of 1.8 pF−35 nH–4.7 pF−35 nH– 6 pF. The cut−off frequency at −3 dB attenuation is 300 MHz and can be used in applications where the data rates are as high as 160 Mbps, while providing greater than −35 dB attenuation over the 800 MHz to 2.7 GHz frequency range. The parts include ESD diodes on every I/O pin and provide a high level of protection against electrostatic discharge (ESD). The ESD protection diodes connected to the external filter ports are designed and characterized to safely dissipate ESD strikes of ±14 kV, which is beyond the maximum requirement of the IEC61000−4−2 international standard. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy−to−use pin assignments. In particular, the EMI9404 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The EMI9404 is housed in space saving, low profile, 0.40 mm pitch UDFN packages in a RoHS compliant, Pb−Free format. Features http://onsemi.com MARKING DIAGRAMS 8 1 L4 M G UDFN8 CASE 517BC L4 MG G 1 = Specific Device Code = Date Code = Pb−Free Package (*Note: Microdot may be in either location) PINOUTS Internal Pins (Lower ESD Event) 1 2 3 4 GND 8 7 6 5 • Four Channels of EMI Filtering with Integrated ESD Protection • ±14 kV ESD Protection (IEC 61000−4−2, contact discharge) at • • • • • External Pin Greater than −40 dB Attenuation (typical) at 1 GHz UDFN Pb−Free Package with 0.40 mm Lead Pitch: 4−ch. = 8−lead UDFN UDFN Package Size: 8−lead: 1.70 mm x 1.35 mm Increased Robustness Against Vertical Impacts During Manufacturing Process These Devices are Pb−Free and are RoHS Compliant External Pins (Higher ESD Event) (Bottom View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers Computers, PDAs etc. • Wireless Handsets • Handheld PCs/PDAs • LCD and Camera Modules © Semiconductor Components Industries, LLC, 2013 January, 2013 − Rev. 1 1 Publication Order Number: EMI9404/D EMI9404 Figure 1. Electrical Schematic Table 1. PIN DESCRIPTIONS Pin # 1 2 3 4 5 6 7 8 GND PAD Name FILTER1 FILTER2 FILTER3 FILTER4 FILTER4 FILTER3 FILTER2 FILTER1 GND Filter + ESD Channel 1 (Internal) Filter + ESD Channel 2 (Internal) Filter + ESD Channel 3 (Internal) Filter + ESD Channel 4 (Internal) Filter + ESD Channel 4 (External) Filter + ESD Channel 3 (External) Filter + ESD Channel 2 (External) Filter + ESD Channel 1 (External) Device Ground Description SPECIFICATIONS MAXIMUM RATINGS Parameter Storage Temperature Range Current per Inductor DC Package Power Rating Value –65 to +150 15 500 Unit °C mA mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating –40 to +85 Unit °C http://onsemi.com 2 EMI9404 ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol LTOT RTOT CTOT_0V CTOT_2.5V VST ILEAK VSIG VESD Parameter Total Channel Inductance Total Channel DC Resistance Total Channel Capacitance, 0 V bias Total Channel Capacitance, 2.5 V bias Stand−off Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In−system ESD Withstand Voltage a) Contact discharge per IEC 61000−4−2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000−4−2 standard, Level 1 (Internal Pins) c.) Air discharge per IEC61000−4−2 standard. Level 4 (External Pins) Clamping Voltage TLP (Note 4) See Figures 4 through 7 Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W 0 V dc; 1 MHz, 30 mVrms 2.5 V dc; 1 MHz, 30 mVrms I = 10 mA VIN = +3.3 V ILOAD = 10 mA ILOAD = −10 mA Notes 2 and 3 5.6 −1.5 ±14 ±2 ±16 IPP = 8 A IPP = 16 A IPP = −8 A IPP = −16 A 13.7 20 −4.4 −7.6 345 V 5.5 0.1 6.8 −0.8 0.5 9.0 −0.4 Conditions Min Typ 70 45 17.5 11.5 24 Max Unit nH W pF pF V mA V kV VC fC 1. 2. 3. 4. MHz TA = 25°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. PERFORMANCE INFORMATION TYPICAL F.


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