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HC5526 Dataheets PDF



Part Number HC5526
Manufacturers Intersil Corporation
Logo Intersil Corporation
Description ITU CO/PABX SLIC with Low Power Standby
Datasheet HC5526 DatasheetHC5526 Datasheet (PDF)

HC5526 Data Sheet October 1998 File Number 4151.6 ITU CO/PABX SLIC with Low Power Standby The HC5526 is a subscriber line interface circuit that is compliant with CCITT standards. Enhancements include immunity to circuit latch-up during hot plug and absence of false signaling in the presence of longitudinal currents. The HC5526 is fabricated in a High Voltage Dielectrically Isolated (DI) Bipolar Process that eliminates leakage currents and device latch-up problems normally associated with Junct.

  HC5526   HC5526


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HC5526 Data Sheet October 1998 File Number 4151.6 ITU CO/PABX SLIC with Low Power Standby The HC5526 is a subscriber line interface circuit that is compliant with CCITT standards. Enhancements include immunity to circuit latch-up during hot plug and absence of false signaling in the presence of longitudinal currents. The HC5526 is fabricated in a High Voltage Dielectrically Isolated (DI) Bipolar Process that eliminates leakage currents and device latch-up problems normally associated with Junction Isolated (JI) ICs. The elimination of the leakage currents results in improved circuit performance for wide temperature extremes. The latch free benefit of the DI process guarantees operation under adverse transient conditions. This process feature makes the HC5526 ideally suited for use in harsh outdoor environments. Features • DI Monolithic High Voltage Process • Programmable Current Feed (20mA to 60mA) • Programmable Loop Current Detector Threshold and Battery Feed Characteristics • Ground Key and Ring Trip Detection • Compatible with Ericsson’s PBL3764 • Thermal Shutdown • On-Hook Transmission • Wide Battery Voltage Range (-24V to -58V) • Low Standby Power • Meets CCITT Transmission Requirements • -40oC to 85oC Ambient Temperature Range PKG. NO. N28.45 E22.4 N28.45 E22.4 Ordering Information PART NUMBER HC5526CM HC5526CP HC5526IM HC5526IP TEMP. RANGE (oC) 0 to 70 0 to 70 -40 to 85 -40 to 85 PACKAGE 28 Ld PLCC 22 Ld PDIP 28 Ld PLCC 22 Ld PDIP Applications • On-Premises (ONS) • Key Systems • PBX • Related Literature - AN9537, Operation of the HC5513/26 Evaluation Board Block Diagram RINGRLY RING RELAY DRIVER 4-WIRE INTERFACE VF SIGNAL PATH VTX RSN DT DR RING TRIP DETECTOR TIP RING HPT HPR GROUND KEY DETECTOR VBAT VCC VEE AGND BGND BIAS RD RDC RSG DET DIGITAL MULTIPLEXER 2-WIRE INTERFACE LOOP CURRENT DETECTOR E0 E1 C1 C2 57 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 HC5526 Absolute Maximum Ratings Operating Temperature Range . . . . . . . . . . . . . . . . -40oC to 110oC Power Supply (-40oC ≤ TA ≤ 85oC) Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . 0.5V to 7V Supply Voltage VEE to GND. . . . . . . . . . . . . . . . . . . . . -7V to 0.5V Supply Voltage VBAT to GND . . . . . . . . . . . . . . . . . . . -70V to 0.5V Ground Voltage between AGND and BGND . . . . . . . . . . . . . -0.3V to 0.3V Relay Driver Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . 0V to VBAT 75V Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Ring Trip Comparator Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VBAT to 0V Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5mA to 5mA Digital Inputs, Outputs (C1, C2, E0, E1, DET) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to VCC Output Voltage (DET Not Active) . . . . . . . . . . . . . . . . . 0V to VCC Output Current (DET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Tipx and Ringx Terminals (-40oC ≤ TA ≤ 85oC) Tipx or Ringx Voltage, Continuous (Referenced to GND) VBAT to 2V Tipx or Ringx, Pulse < 10ms, TREP > 10s . . . . . .VBAT -20V to 5V Tipx or Ringx, Pulse < 10µs, TREP > 10s . . . . VBAT -40V to 10V Tipx or Ringx, Pulse < 250ns, TREP > 10s. . . . VBAT -70V to 15V Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70mA ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V Thermal Information Thermal Resistance (Typical, Note 1) θJA (oC/W) 22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . 53 28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . 53 Continuous Dissipation at 70oC 22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W 28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W Package Power Dissipation at 70oC, t < 100ms, tREP > 1s 22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W 28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W Derate above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70oC PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18.8mW/oC PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18.8mW/oC Maximum Junction Temperature Range. . . . . . . . . . -40oC to 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (PLCC - Lead Tips Only) Die Characteristics Gate Count . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress.


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