Package information
Package information - SOT23-6
Surface mounted, 6 pin package Package outline
DIM A A1 A2 b C D E E1 L e e1 L Min. 0.90 ...
Description
Package information - SOT23-6
Surface mounted, 6 pin package Package outline
DIM A A1 A2 b C D E E1 L e e1 L Min. 0.90 0.00 0.90 0.35 0.09 2.70 2.20 1.30 0.10
Millimeters Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.60 0.95 REF 1.90 REF 0° 30° 0° Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511 0.0039
Inches Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0236 0.0374 REF 0.0748 REF 30°
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
0.95 0.037 1.06 0.042 2.2 0.087
0.65 0.026
mm inches
Issue 4 - November 2007
© Zetex Semiconductors plc 2007
1
www.zetex.com
Nominal weight
Nominal weight per device 18mg.
Tape and reel information
Orientation Tape width (mm) Reel size (inches) No. of components 3,000
Pin 1
Tape option indicator TA TC
8
13
10,000
Embossed carrier tape configuration
P0 K t
Top cover tape
D
P2
10 pitches culmulative tolerance on tape ±0.2mm (±0.008”)
E
See Note 1
A0
See Note 1
F
W
B1
K0
See Note 1
B0 P
Embossment Center lines of cavity
D1
User direction of feed
8 A0, B0, K0 B1 (max.) D D1 (max.) E F P See note* 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004)
12 See note* 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004)
16 See note* 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 7.50 ± 0.10 (0.295 ± 0...
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