XP2-17

LatticeXP2™ Family Data Sheet DS1009 Version 2.2, September 2014 LatticeXP2 Family Data Sheet Introduction February 2012 Features  flexiFLASH™ Architecture Instant-on Infinitely reconfigurable Single chip FlashBAK™ technology Serial TAG memory Design security  Live Update Technology TransFR™ technology Secure updates with 128 bit AES encryption Dual-boot with external SPI  sysDSP™ Block Three to eight blocks for high performance  Multiply and Accumulate 12 to 32 18x18 multipliers Each block supports one 36x36 multiplier or four 18x18 or eight 9x9 multipliers  Embedded and Distributed Memory Up to 885 Kbits sysMEM™ EBR Up to 83 Kbits Distributed RAM  sysCLOCK™ PLLs Up to four analog PLLs per device Clock multiply, divide and phase shifting Data Sheet DS1009  Flexible I/O Buffer sysIO™ buffer supports: – LVCMOS 33/25/18/15/12; LVTTL – SSTL 33/25/18 class I, II – HSTL15 class I; HSTL18 class I, II – PCI – LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS  Pre-engineered Source Synchronous Interfaces DDR / DDR2 interfaces up to 200 MHz 7:1 LVDS interfaces support display applications XGMII  Density And Package Options 5k to 40k LUT4s, 86 to 540 I/Os csBGA, TQFP, PQFP, ftBGA and fpBGA packages Density migration supported  Flexible Device Configuration SPI (master and slave) Boot Flash Interface Dual Boot Image supported Soft Error Detect (SED) macro embedded  System Level Support IEEE 1149.1 and IEEE 1532 Compliant On-chip os...