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SK2150SC Dataheets PDF



Part Number SK2150SC
Manufacturers Cystech Electonics
Logo Cystech Electonics
Description 2.0Amp. Surface Mount Schottky Barrier Diodes
Datasheet SK2150SC DatasheetSK2150SC Datasheet (PDF)

CYStech Electronics Corp. 2.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 1/ 5 SK220SC-SK2150SC Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 sec.

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CYStech Electronics Corp. 2.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 1/ 5 SK220SC-SK2150SC Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, SMC/JEDEC DO-214AB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=2A Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃ VR=VRRM,TA=125℃ Maximum thermal resistance, Junction to ambient Maximum thermal resistance, Junction to lead Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage Storage temperature Operating temperature Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area. Symbol VRRM VRMS VR VF IO IFSM IR Rth,JA Rth,JL CJ Tstg TJ Type Units SK220 SK240 SK260 SK2100 SK2150 20 40 60 100 150 V 14 28 42 70 105 V 20 40 60 100 150 V 0.50 0.7 2 50 0.5 10 55 20 (Note) 170(typ) -55 ~ +125 -55 ~ +150 -55 ~ +150 0.85 0.9 V A A mA mA ℃/W pF ℃ ℃ SK220SC-SK2150SC CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 2.5 Average Forward Current---Io(A) Peak Forward Surge Current---IFSM (A) Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 2/ 5 Maximum Non-Repetitive Forward Surge Current 60 50 40 30 20 10 0 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method 2 1.5 1 0.5 0 0 50 100 150 200 Ambient Temperature---TA(℃) 1 10 Number of Cycles at 60Hz 100 Forward Current vs Forward Voltage 10 Instantaneous Forward Current---IF (A) Junction Capacitance vs Reverse Voltage 700 Junction Capacitance---C J(pF) SK22-SK24 600 500 400 300 200 100 0 1 SK26 SK28-SK2B Tj=25℃, Pulse width=300μs, 1% Duty cycle 0.1 0.01 0.1 0.3 0.5 0.7 0.9 1.1 Forward Voltage---VF(V) 1.3 1.5 0.01 0.1 1 10 100 Reverse Voltage---VR (V) Reverse Leakage Current vs Reverse Voltage 100 Reverse Leakage Current---I R (mA) 10 1 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) SK220SC-SK2150SC CYStek Product Specification CYStech Electronics Corp. Ordering Information Device SK220SC SK240SC SK260SC SK2100SC SK2150SC Package SMC SMC SMC SMC SMC Shipping 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel 3000 pcs / Tape & Reel Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 3/ 5 Marking SK22 SK24 SK26 S210 S215 SK220SC-SK2150SC CYStek Product Specification CYStech Electronics Corp. Recommended temperature profile for IR reflow Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 4/ 5 Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds 240 +0/-5 °C 10-30 seconds 6°C/second max. 6 minutes max. Pb-free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260 +0/-5 °C 20-40 seconds 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. SK220SC-SK2150SC CYStek Product Specification CYStech Electronics Corp. DO-214AB/SMC Dimension Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 5/ 5 DO-214AB/SMC Plastic Surface Mounted Package CYStek Package Code : SC *:Typical DIM A B C D Inches Min. Max. 0.114 0.126 0.220 0.245 0.260 0.280 0.078 0.103 Millimeters Min. Max. 2.90 3.20 5.59 6.22 6.60 7.11 1.98 2.62 DIM E F G H Inches Min. Max. 0.006 0.012 0.004 0.008 0.030 0.060 0.305 0.320 Millimeters Min. Max. 0.15 0.31 0.10 0.20 0.76 1.52 7.75 8.13 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epo.


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