PSHI50

ECO-PAC 2 PSHI 50/06* H-Bridge Configuration Short Circuit SOA Capability Square RBSOA F10 Preliminary Data Sheet TM IGBT Module IC25 = 42.5 A VCES = 600 V VCE(sat)typ. = 2.4 V A1 K10 K13 H13 S18 IGBTs Symbol VCES VGES IC25 IC80 ICM VCEK tSC (SCSOA) Ptot Symbol TC = 25°C TC = 80°C Conditions TVJ = 25°C to 150°C N9 NTC P18 PSHI 50/06* *NTC optional Features Maximum Ratings 600 ± 20 42.5 29 60 VCES 10 130 V V A A A µs W VGE = ±15 V; RG = 33 Ω; TVJ = 125°C RBSOA, Clamped inductive load; L = 100 µH VCE = VCES; VGE = ±15 V; RG = 33 Ω; TVJ = 125°C non-repetitive TC = 25°C Conditions Characteristic Values (TVJ = 25°C, unless otherwise specified) min. typ. max. 2.4 2.9 4.5 2.9 6.5 0.6 1.7 100 50 50 270 40 1.4 1.0 16 1.92 V V V mA mA nA ns ns ns ns mJ mJ nF 0.96 K/W K/W NPT IGBT technology low saturation voltage low switching losses square RBSOA, no latch up high short circuit capability positive temperature coefficient for easy parallelling MOS input, voltage controlled ultra fast free wheeling diodes solderable pins for PCB mounting package with copper base plate Isolation voltage 3000 V∼ UL registered, E 148688 VCE(sat) VGE(th) ICES IGES td(on) tr td(off) tf Eon Eoff Cies RthJC RthJH IC = 50 A; VGE = 15 V; TVJ = 25°C TVJ = 125°C IC = 0.7 mA; VGE = VCE VCE = VCES; VGE = 0 V; TVJ = 25°C TVJ = 125°C Advantages space and weight savings reduced protection circuits package designed for wave soldering High power density Easy to moun...