SPEC NO :
SPECIFICATION
CUSTOMER PRODUCT MODEL NO PREPARED APPROVED SAW RESONATOR HDR...
SPEC NO :
SPECIFICATION
CUSTOMER PRODUCT MODEL NO PREPARED APPROVED SAW RESONATOR HDR433MS3 CHECKED D A T E 2006-5-11
CUSTOMER RECEIVED:
CHECKED
APPROVED
DATE
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SAW RESONATOR
HDR433MS3
History Record
Date Spec. No. Part No. Customer No. Modify Content Remark
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SAW RESONATOR
HDR433MS3
1. SCOPE
This specification shall cover the characteristics of 1port SAW resonator with 433.92M used for remotecontrol security.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC 10V AC Voltage Vpp 10V50Hz/60Hz Operation temperature 40℃ to +85℃ Storage temperature 45℃ to +85℃ RF Power Dissipation 0dBm 2.2Electronic Characteristics
Item Center Frequency Insertion Loss Quality Factor Unload Q 50Ω Loaded Q Temperature Stability Turnover Temperature Freq.temp.Coefficient ℃ ppm/℃2 ppm/yr MΩ Ω μH fF pF 1.0 16 81.06 1.6596 1.96 26 Motional Resistance R1 Motional Inductance L1 Motional Capacitance C1 Transducer Static Capacitance Unites MHz dB Minimum 433.845 8000 1000 10 Typical 433.920 1.5 12800 2000 25 0.032 <±10 40 Maximum 433.995 2.5
Frequency Aging DC. Insulation Resistance RF Equivalent RLC Model
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SAW RESONATOR
HDR433MS3
3. TEST CIRCUIT
4. DIMENSION
2.Input 6.Output 1.3.5.7.Gound 4.8 Ground
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SAW RESONATOR
HDR433MS3
5. ENVIRONMENTAL CHARACTERISTICS
51 Temperature cycling Subject the device to a low temperature of 40℃for 30 minutes. Following by a high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in 2.2. 52 Resistance to solder heat Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in 2.2. 53 Solderability Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in 2.2.