Power MOSFET
Applications
D
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power...
Description
Applications
D
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power Switching
l Hard Switched and High Frequency Circuits
G
Benefits l Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness l Fully Characterized Capacitance and Avalanche
SOA l Enhanced body diode dV/dt and dI/dt Capability l Lead-Free
S
D
DS G TO-220AB IRFB4310ZPbF
PD - 97115D
IRFB4310ZPbF IRFS4310ZPbF IRFSL4310ZPbF
HEXFET® Power MOSFET
VDSS RDS(on)
typ. max.
ID (Silicon Limited)
ID (Package Limited)
100V 4.8m: 6.0m: 127A c
120A
D D
DS G
D2Pak IRFS4310ZPbF
DS G
TO-262 IRFSL4310ZPbF
G Gate
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C ID @ TC = 100°C ID @ TC = 25°C IDM PD @TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited) Continuous Drain Current, VGS @ 10V (Silicon Limited) Continuous Drain Current, VGS @ 10V (Wire Bond Limited) Pulsed Drain Current d Maximum Power Dissipation Linear Derating Factor
VGS
dv/dt TJ TSTG
Gate-to-Source Voltage Peak Diode Recovery f Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
EAS (Thermally limited) IAR
Single Pulse Avalanche Energy e Avalanche Current c
EAR
Repetitive Avalanche Energy g
Thermal Resistance
Symbol
Parameter
RJC RCS RJA RJA
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Junction-to-Case k Case-to-Sink, Flat Greased Surface , TO-220 Junction-to-Ambient, TO-220 k Junction...
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