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NS2W157ART Dataheets PDF



Part Number NS2W157ART
Manufacturers NICHIA CORPORATION
Logo NICHIA CORPORATION
Description WHITE LED
Datasheet NS2W157ART DatasheetNS2W157ART Datasheet (PDF)

NICHIA STS-DA1-1338B NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NS2W157ART ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant http://www.Datasheet4U.com NICHIA STS-DA1-1338B SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Junction Temperature Symbol IF IFP IR PD Topr Tstg TJ Absolute Maximum R.

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NICHIA STS-DA1-1338B NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NS2W157ART ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant http://www.Datasheet4U.com NICHIA STS-DA1-1338B SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Junction Temperature Symbol IF IFP IR PD Topr Tstg TJ Absolute Maximum Rating 90 120 85 612 -40~100 -40~100 120 Unit mA mA mA mW °C °C °C * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%. (2) Initial Electrical/Optical Characteristics Item Forward Voltage Luminous Flux Luminous Intensity Chromaticity Coordinate Thermal Resistance * Characteristics at TS=25°C. * Luminous Flux value as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RθJS is Thermal Resistance from junction to TS measuring point. xyRθJS Symbol VF Φv Iv Condition IF=75mA IF=75mA IF=75mA IF=75mA IF=75mA Typ 6.1 57.8 19.4 0.344 0.355 17 Max 24 Unit V lm cd °C/W 1 NICHIA STS-DA1-1338B RANKS Item Forward Voltage Luminous Flux - 5. P15 60. P14 51. P13 42. Color Ranks Rank b3 x y 0.287 0. 0.295 0. 283 0. 305 0. Rank b5 x y 0.296 0. 0.276 0. 287 0. 295 0. Rank c1 x y 0.330 0. 0.339 0. 330 0. 360 0. 361 0. 385 0. 357 361 x y 0.330 0. 0.318 0. 307 0. 315 0. 311 294 x y 0.311 0. 0.294 0. 304 0. 330 0. 307 315 x y 0.307 0. 0.315 0. Rank b4 304 0. 330 0. Rank b6 307 0. 315 0. Rank c2 330 0. 339 0. 357 361 0.356 0.351 330 339 0.330 0.318 330 360 0.330 0.339 Rank Min 4 5 0 8 Max 6.8 72.0 60.5 51.0 lm Unit V * Ranking at TS=25°C. * Forward Voltage Tolerance: ±0.08V * Luminous Flux Tolerance: ±7% * Chromaticity Coordinate Tolerance: ±0.005 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. 2 NICHIA STS-DA1-1338B CHROMATICITY DIAGRAM 0.45 0.40 c1 0.35 c2 b4 y b6 b3 0.30 b5 0.25 0.20 0.20 0.25 0.30 x 0.35 0.40 0.45 3 NICHIA STS-DA1-1338B OUTLINE DIMENSIONS * はRoHSにしております。 This product complies with RoHS Directive. No. NS2W157xR STS-DA7-0258A ( Unit:±0.2) mm) ( Unit: mm, Tolerance: 3 (2.6) 0.52 (0.2) 2.6 (0.3) (0.6) 1.4 0.86 (1) Cathode 1.56 0.54 Anode Item パッケージ Package Materials Encapsulating Resin Materials Electrodes Materials Weight Description ポリマー Heat-Resistant Polymer シリコーン (+り) Silicone Resin (with diffuser and phosphor) +メッキ Ag-plated Copper Alloy 0.0073g(TYP) K A * バリはにまないものとします。 Dimensions do not include mold flash or metal burr. Protection Device 4 NICHIA STS-DA1-1338B SOLDERING • Recommended Reflow Soldering Condition(Lead-free Solder) • Recommended Hand Soldering Condition Temperature 1 to 5°C per sec Pre-heat 180 to 200°C 60sec Max Above 220°C 120sec Max 260°CMax 10sec Max Soldering Time 350°C Max 3sec Max • Recommended Soldering Pad Pattern • Recommended Metal Solder Stencil Aperture 0.8 2.4 0.8 0 .6 6 0 .8 6 0 .8 6 1 .5 5 0.6 1.66 0.5 0.64 0.6 0.6 1.56 0.7 0.54 0.6 ( Unit: mm) * This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * When soldering, do not apply stress to the LED while the LED is hot. * When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface and may also cause the LED not to illuminate. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact w.


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