Document
Stacked Film Capacitor Chips
FEATURES • STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM • STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES • WIDE TEMPERATURE RANGE UP TO +125OC (100pF ~ 0.1μF) • HIGH HEAT AND MOISTURE RESISTANT • VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS CHARACTERISTICS • SUITABLE FOR REFLOW SOLDERING • TAPE AND REEL PACKAGING
NSHC IS RECOMMENDED FOR NEW DESIGNS
NSHC Series
includes all homogeneous materials
RoHS Compliant
*See Part Number System for Details SPECIFICATIONS Capacitance Range Voltage Ratings Capacitance Tolerance Temperature Range Dissipation Factor (20°C) Insulation Resistance (20°C) Dielectric Withstanding Voltage Temperature Characteristic Case Sizes 0603 0805 1206 1210 1913 2416 100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF 16Vdc (12Vrms), 50Vdc (40Vrms) ±5% Std, ±2% Opt. -55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C) 0.6% max. @ 1KHz 3 Gigohms Minimum 150% of Rated Voltage 60 Seconds or 175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes) ±3% ΔC Maximum Over Temperature Range
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C 1,000 Hours at 125% of Rated Voltage Resistance to Soldering Heat +260°C Peak Humidity Load Life: (1) 1000 Hours, +40°C (2) 500 Hours, +60°C (3) 500 Hours +85°C/85% RH Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Within ±2% of Initial Value 0.68% Maximum 1 Gigohm Minimum Within ±3% of Initial Value 0.66% Maximum 1 Gigohm Minimum (1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value (1) & (2) 0.90% Maximum (3) 1.2% maximum (1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE (maximum 2 times)
300 Peak Temperature 260°C
Temperature - Deg. C
RECOMMENDED LAND PATTERN (mm) Case Code J1 A1, A2 B1, B2, B3 C2, C3 D5, D6 E6, E7, E8 EIA Size 0603 0805 1206 1210 1913 2416 A 0.6 0.8 1.8 1.8 3.0 4.0 B 2.0 2.4 3.6 3.6 5.6 7.0 C 0.7 1.1 1.4 2.3 3.0 3.8
250 200 150 100 50 25 Ramp-up 25°C ~ 150°C 90 sec. max. Pre-heat 150°C ~ 180°C 120 sec. max.
Cool Down Time above 230°C 30 sec. max.
0
Time
Solder within 1 year. Storage at +30°C and 60% RH
A B
®
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
C
SPECIFICATIONS ARE SUBJECT TO CHANGE
http://www.Datasheet4U.com
1
Stacked Film Capacitor Chips
16V STANDARD PRODUCTS AND CASE SIZES
Part Number NSHC101J16TRJ1F NSHC121J16TRJ1F NSHC151J16TRJ1F NSHC181J16TRJ1F NSHC221J16TRJ1F NSHC271J16TRJ1F NSHC331J16TRJ1F NSHC391J16TRJ1F NSHC471J16TRJ1F NSHC561J16TRJ1F NSHC681J16TRJ1F NSHC821J16TRJ1F NSHC102J16TRJ1F NSHC122J16TRJ1F NSHC152J16TRJ1F NSHC182J16TRJ1F NSHC222J16TRJ1F NSHC272J16TRJ1F NSHC332J16TRA1F NSHC392J16TRA1.