V-Chip Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH CHARACTERISTICS
Rated Voltage Range Rated Capacitance Range Operating Temp. Range Capacitance Tolerance Load Life Test +70°C 1,000 hours Temperature Cycling (5 cycles, -25 ~ +70°C 3.5 & 5.5VDC 0.047F ~ 1.0F (47,000μF ~ 1,000,000μF) -25°C ~ +70°C +80%/-20% (Z) Δ Capacitance Change Maximum ESR Current at 30 minutes Δ Capacitance Change Maximum ESR Current at 30 minutes Δ Capacitance Change Maximum ESR Current at 30 minutes *For high temperature +85°C, high temperature reflow parts see the NEXCW series
NEXC Series
Humidity Resistance (240 hours @ 40°C/90% RH)
Less than ±30% of initial measured value Less than 200% of the specified maximum value Less than 200% of the specified maximum value Within +80%/-20% of specified value Less than specified maximum value Less than specified maximum value Less than ±20% of initial measured value Less than 120% of the specified maximum value Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
NIC P/N NEXC104Z3.5V10.5X5.5TRF NEXC224Z3.5V10.5X5.5TRF NEXC474Z3.5V10.5X8.5TRF NEXC473Z5.5V10.5X5.5TRF NEXC104Z5.5V10.5X5.5TRF NEXC224Z5.5V10.5X8.5TRF NEXC474Z5.5V16X9.5TRF NEXC105Z5.5V21X10.5TRF Capacitance Value (F) Discharge 0.1 0.22 0.47 0.047 0.1 0.22 0.47 1.0 Working Voltage (VDC) 3.5 3.5 3.5 5.5 5.5 5,5 5.5 5.5 Holding Voltage (VDC min.) 4.2 4.2 4.2 4.2 4.2 Max. Current @ 30 minutes (mA) 0.090 0.200 0.420 0.071 0.150 0.330 0.710 1.500 Max. ESR @ 1KHz (Ω) 50 25 25 50 25 25 13 7
CASE DIMENSIONS (mm)
Case Size 10.5 x 5.5 10.5 x 8.5 16 x 9.5 21 x 10.5 Dφ ± 0.5 10.5 10.5 16.0 21.0 L max. 5.5 8.5 9.5 10.5 A/B ±0.2 10.8 10.8 16.3 21.6 I 3.6 ±0.5 3.6 ±0.5 6.8 ±1.0 7.0 ±1.0 W 1.2 1.2 1.2 1.4 P 5.0 5.0 5.0 10.0
+
Dφ 0.3mm max.
I
I
I
A
w
L P B
WASHING is NOT RECOMMENDED. Additional precautions can be found at www.niccomp.com/precautions If in doubt or uncertainty, please review your speci fic application - process details with NIC’s technical support personnel:
[email protected]
PRECAUTIONS
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
http://www.Datasheet4U.com
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V-Chip Memory Back-Up Capacitors
LAND PATTERN DIMENSIONS (mm)
Case Diameter 10.5 16.0 21.0 R 5.0 5.0 10.0 S 4.6 10.0 10.5 T 2.5 2.5 3.5 T COMPONENT OUTLINE
NEXC Series
S R
S
STANDARD RECOMMENDED REFLOW PROFILE
Temperature - Deg. C
250 200 150 100 50 25 Pre-heat 160°C 120 sec. max. Time above 200°C 30 sec. max. Cool Down Peak Temperature (235°C for 10 sec.)
0
Time
1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. 2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process.
2
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
V-Chip Memory Back-Up Capacitors
CARRIER TAPE DIMENSIONS (mm)
Case Size 10.5 x 5.5 10.5 x 8.5 16 x 9.5 21 x 10.5 A 11.4 11.4 18.0 23.0 B 13.0 13.0 20.0 25.0 D 1.55 1.55 1.55 1.55 E 1.75 1.75 1.75 1.75 F 11.5 11.5 14.2 20.2 G 28.4 40.4 P 4.0 4.0 4.0 4.0 P1 16.0 16.0 24.0 32.0 T1 0.4 0.4 0.5 0.5 T2 6.0 8.4 10.0 12.0 W 24.0 24.0 32.0 44.0
NEXC Series
Quantity/Reel 1,000 500 200 150
P
1.5 D∅ +0.1/-
1.75 ±
E F
T1
W
B
+
A
P1
Feeding
T2
REEL DIMENSIONS (mm)
Case Size 10.5 x 5.5 10.5 x 8.5 16 x 9.5 21 x 10.5 A ± 2.0 380 380 330 370 B ± 1.0 80.0 100.0 100.0 100.0 C ± 0.5 13.0 13.0 13.0 13.0 D ± 0.8 21.0 21.0 21.0 21.0 E ± 0.5 2.0 2.0 2.0 2.0 W 25.5 25.5 33.5 45.5 t 3.0 2.8 2.8 2.8
t
C
E
A
B
W
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
3
.