PROCESS
5.0 Volt TVS Chip
CPZ36R
Transient Voltage Suppressor
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 10.2 x 10.2 MILS 3.9 MILS 7.1 MILS DIAMETER Al - 30,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 163,034 PRINCIPAL DEVICE TYPE CMATVS5V0
R0 (5-January 2012)
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