CPZ28

PROCESS Zener Diode CPZ28 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 13 x 13 MILS 7.8 MILS 7.0 x 7.0 MILS Ti/Al - 13,000Å Au-As - 13,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 101,184 PRINCIPAL DEVICE TYPES CMPZ5221B THRU CMPZ5267B R0 BACKSIDE CATHODE R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPZ28 Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com ...