PROCESS
CPD94X
Schottky Diode
0.5 Amp Schottky Diode Chip
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 20 x 20 MILS 5.9 MILS 16 x 16 MILS Al - 20,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 42,213 PRINCIPAL DEVICE TYPES CMDSH05-4 CMLSH05-4 CMPSH05-4
R0 (19-July 2010)
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