PROCESS
CPD92X
Schottky Diode
High Voltage Schottky Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 9.0 x 9.0 MILS 5.9 MILS 4.8 MILS DIAMETER Al - 30,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 209,532 PRINCIPAL DEVICE TYPES CMDD6263 CMKD6263 CMLD6263...
