CPD69

PROCESS General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip CPD69 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 42.5 x 42.5 MILS 12.5 MILS 32 x 32 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 6,200 PRINCIPAL DEVICE TYPES CMR1-02 Series CMR1-02M Series CXR1-04 CXR1-04C CZR1-04 CZR1-04C R5 (5-April 2011) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD69 Typical Electrical Characteristics R5 (5-April 2011) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com ...