PROCESS
Schottky Rectifier
CPD107
3 Amp Schottky Rectifier Chip
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 56 x 56 MILS 11.8 MILS 51 x 51 MILS Al - 30,000Å Ag - 20,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 5,516 PRINCIPAL DEVICE TYPE CZSH6-100C
R0 (1-March 2011)
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