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LQFP44

PC board footprint

Description

Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.800 P2 Ax Ay Bx By C 1.500 D1 0.500 D2 0.600 Gx Gy Hx ...

Philips

Download LQFP44 Datasheet

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