SOCKET
F-214
QRF8–078–05.0–L–D–A
QRF8–036–05.0–L–D–DP–A
®
(0,80 mm) .0315"
QRF8–026–05.0–L–D–A
QRF8 SERIES
SLIM BODY GRO...
Description
F-214
QRF8–078–05.0–L–D–A
QRF8–036–05.0–L–D–DP–A
®
(0,80 mm) .0315"
QRF8–026–05.0–L–D–A
QRF8 SERIES
SLIM BODY GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and recommended PCB layouts see www.samtec.com?QRF8 Insulator Material: Black LCP Contact Material: BeCu Ground Plane Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 2.2 A per pin (1 pin powered per row) Ground Plane: 8.5 A per ground plane (1 ground plane powered) Operating Temp Range: -55°C to +125°C Voltage Rating: 215 VAC RoHS Compliant: Yes
Board Mates: QRM8, EQRD
Increased wipe ™ for rugged applications
Integral ground/power plane Edge Rate™ contacts
(1,20 mm) .047" NOMINAL WIPE
s ocol Prot orted Supp
Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9.5 GHz / 19 Gbps 15 GHz / 30 Gbps Differential Pair Signaling –D 8.5 GHz / 17 Gbps 12.5 GHz / 25 Gbps Differential Pair Signaling –DP 9 GHz / 18 Gbps –––– *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QRF8 or contact sig@samtec.com Type
QRM8/QRF8 7 mm Stack Height
notes at Download app ppnote om/a www.samtec.c mtec.com @ sa Contact SIG on protocols for questions
100 GbE
Processing:
Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (018-026) (0,15 mm) .006" max (036-078)
QRF8
PINS...
Similar Datasheet
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