MICROWAVE POWER GaAs FET
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 39.5dBm at 7.7GHz to 8.5GHz ・HIGH GAIN
G1dB= 6.0dB at 7.7G...
Description
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 39.5dBm at 7.7GHz to 8.5GHz ・HIGH GAIN
G1dB= 6.0dB at 7.7GHz to 8.5GHz ・HERMETICALLY SEALED PACKAGE ・LOW INTERMODULATION DISTORTION
IM3= -45dBc at Pout= 28.5dBm Single Carrier Level.
MICROWAVE POWER GaAs FET
TIM7785-8SL
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point
Drain Current
Gain Flatness
SYMBOL
CONDITIONS
P1dB
G1dB IDS1 ∆G
VDS= 10V IDSset= 2.2A f = 7.7 to 8.5GHz
UNIT dBm dB
A dB
Power Added Efficiency
ηadd
%
3rd Order Intermodulation Distortion
Drain Current
IM3 IDS2
Two Tone Test
dBc
Po= 28.5dBm, ∆f= 5MHz
(Single Carrier Level)
A
Channel Temperature Rise
∆Tch
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
°C
Recommended Gate Resistance(Rg): 150 Ω
MIN. 38.5 5.0 -42
TYP. MAX.
39.5
6.0
2.2
2.6
±0.6
30
-45
2.2
2.6
80
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance
SYMBOL gm
VGSoff IDSS
CONDITIONS
VDS= 3V IDS= 3.0A
VDS= 3V IDS= 30mA
VDS= 3V VGS= 0V
VGSO IGS= -100µA
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
S
1.8
V
-1.0 -2.5 -4.0
A
5.2
V
-5
°C/W
2.5
3.8
The information contained herein is presented as guidance for product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other...
Similar Datasheet