AUIRF7738L2TR1

PD - 96333A AUTOMOTIVE GRADE Advanced Process Technology Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications Exceptionally Small Footprint and Low Profile High Power Density Low Parasitic Parameters Dual Sided Cooling 175°C Operating Temperature Repetitive Avalanche Capability for Robustness and Reliability Lead Free, RoHS Compliant and Halogen Free Automotive Qualified * Applicable DirectFET® Outline and Substrate Outline  Automotive DirectFET® Power MOSFET ‚ V(BR)DSS 40V RDS(on) typ. 1.2mΩ max. ID (Silicon Limited) Qg 1.6mΩ 184A 129nC AUIRF7738L2TR AUIRF7738L2TR1 S D G S S S S S D L6 DirectFET® ISOMETRIC SB SC M2 M4 L4 L6 L8 Description The AUIRF7738L2 combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging technology to achieve exceptional performance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile.The DirectFET® package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes.The DirectFET® package allows dual sided cooling to maximize thermal transfer in automotive power systems. This HEXFET® Power MOSFET is designed for applications where efficiency and power density are of value. The advanced DirectFET® packaging platform couple...