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MCIMX353DJQ5C Dataheets PDF



Part Number MCIMX353DJQ5C
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description i.MX35 Applications Processors
Datasheet MCIMX353DJQ5C DatasheetMCIMX353DJQ5C Datasheet (PDF)

Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11 products with the right performance and integration to address a.

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Document
Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11 products with the right performance and integration to address applications within the industrial and consumer markets for applications such as HMI and display controllers. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX353 and i.MX357 devices and referred to singularly throughout this document as i.MX35 or MCIMX35. The i.MX353 devices do not include a graphics processing unit (GPU). For information on i.MX35 devices for automotive applications, please refer to document number, MCIMX35SR2AEC. The i.MX35 processor takes advantage of the ARM1136JF-S™ core running at 532 MHz that is boosted by a multi-level cache system and integrated features such as LCD controller, Ethernet, and graphics acceleration for creating rich user interfaces. The i.MX35 supports connections to various types of external memories, such as SDRAM, mobile DDR, and DDR2, SLC and MCL NAND Flash, NOR Flash and 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Functional Description and Application Information. . . . . . 4 2.1. Application Processor Domain Overview . . . . . . . . . 5 2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6 2.3. Advanced Power Management Overview . . . . . . . . 6 2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6 2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Signal Descriptions: Special Function Related Pins . . . . 12 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12 4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.3. Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18 4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 19 4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20 4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23 4.9. Module-Level AC Electrical Specifications . . . . . . . 29 5. Package Information and Pinout . . . . . . . . . .


MCIMX353CJQ5C MCIMX353DJQ5C MCIMX357CJQ5C


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