Document
HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190
Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red for AS AlInGaP and 631 nm red for TS AlInGaP. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C170/C190/C191/C150) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C170/C190/C191 and 3000 units per reel for HSMx-C110/C150. These packages are compatible with IR soldering process. Features • High brightness AlInGaP material • Small size • Industry standard footprint • Diffused optics • • • • • Top emitting or right angle emitting Available in 3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags
Applications • LCD backlighting • Push button backlighting • Front panel indicator • Symbol indicator • Microdisplays • Small message panel signage
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Package Dimensions
LED DIE CATHODE LINE
LED DIE CATHODE MARK
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024)
3.2 (0.126 ) CLEAR EPOXY
2.0 (0.079 )
POLARITY
1.4 (0.055)
DIFFUSED EPOXY
POLARITY
1.5 (0.059) PC BOARD 0.5 (0.020)
0.3 (0.012) PC BOARD 0.8 (0.031) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006)
1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031)
CATHODE LINE
1.0 (0.039)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C110
HSMx-C170
LED DIE
CATHODE MARK
LED DIE
CATHODE MARK
0.8 (0.031) 0.4 (0.016)
0.8 (0.031) 0.4 (0.016)
1.6 (0.063 )
1.6 (0.063 )
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006)
POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006)
1.0 (0.039)
POLARITY
0.6 (0.023) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C190
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C191
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LED DIE
CATHODE MARK
Package Dimensions, continued
1.6 (0.063) 0.8 (0.031)
3.2 (0.126 )
DIFFUSED EPOXY 0.6 (0.024)
2.0 (0.079)
POLARITY
1.1 (0.043) PC BOARD CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008)
SOLDERING TERMINAL
HSMx-C150
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Device Selection Guide Footprint (mm)[1,2] 1.6 x 0.8 x 0.8 2.0 x 1.25 x 0.8 3.2 x 1.0 x 1.5 1.6 x 0.8 x 0.6 3.2 x 1.6 x 1.1 AS AlInGaP Amber HSMA-C190 HSMA-C170 HSMA-C110 HSMA-C191 HSMA-C150 AS AlInGaP Orange HSML-C190 HSML-C170 HSML-C110 HSML-C191 HSML-C150 AS AlInGaP Red HSMC-C190 HSMC-C170 HSMC-C110 HSMC-C191 HSMC-C150 TS AlInGaP Red HSMZ-C190 HSMZ-C170 HSMZ-C110 Package Description Untinted, Diffused Untinted, Diffused Untinted, Nondiffused Untinted, Diffused Untinted, Diffused
Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings TA = 25°C HSMA-C110/170/190/191/150 HSML-C110/170/190/191/150 HSMC-C110/170/190/191/150 25 60 5 95 –30 to +85 –40 to +85
Parameter DC Forward Current[1,2] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
HSMZ-C110/170/190 25 65 5 95 –30 to +85 –40 to +85
Units mA mW V °C °C °C
See reflow soldering profile (Figure 7 & 8)
Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance.
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Electrical Characteristics TA = 25°C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 1.9 1.9 2.2 1.9 1.9 1.9 2.2 2.4 2.4 2.4 2.8 2.4 2.4 2.4 2.6 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 45 45 45 35 45 45 45 35 Thermal Resistance RθJ-PIN = (°C/W) Typ. 600 600 600 600 300 300 300 300
Parameter Number HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 HSMA-C170/190/191/150 HSML-C170/190/191/150 HSMC-C170/190/191/150 HSMZ-C170/190
Optical Characteristics TA = 25°C Lumi.