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HSMF-C169 Dataheets PDF



Part Number HSMF-C169
Manufacturers Avago
Logo Avago
Description Miniature Bi-Color Surface Mount ChipLEDs
Datasheet HSMF-C169 DatasheetHSMF-C169 Datasheet (PDF)

HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place opera.

  HSMF-C169   HSMF-C169



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HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering. Features • Small size • 0603 industry standard footprint • Diffused optics • Operating temperature range of –40° C to +85° C • Compatible with reflow soldering • Available in various color combination • Available in 8 mm tape on 7" (178 mm) diameter reels Applications • Keypad backlighting • Symbol indicator • LCD backlighting • Pushbutton backlighting • Front panel indicator Device Selection Guide Part Number HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 Color AlInGaP Red / AlInGaP Amber AlInGaP Red / InGaN Green AlInGaP Red / InGaN Blue High Efficiency Red / GaP Green GaP Yellow / GaP Green GaP Orange / GaP Green InGaN Green / InGaN Blue AlInGaP Amber / InGaN Blue Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Free Datasheet http://www.Datasheet-PDF.com/ Package Dimensions LED DIES 1 2 1.6 (0.063†) CATHODE LINE 3 0.8 (0.031) 4 DIFFUSED EPOXY 0.5 (0.020) PC BOARD 0.16 (0.006) CATHODE LINE 0.4 (0.016) 0.3 (0.012) SOLDERING TERMINALS POLARITY 1 2 3 4 HSMF-C162 AMBER RED HSMF-C163 GREEN RED HSMF-C164 BLUE RED HSMF-C165 GREEN RED HSMF-C166 GREEN YELLOW HSMF-C167 GREEN ORANGE HSMF-C168 BLUE GREEN HSMF-C169 BLUE AMBER Notes: 1. All Dimensions in millimeters (Inches). 2. tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Absolute Maximum Ratings for Each Die at TA = 25° C Parameter AlInGaP InGaN GaP Units DC Forward Current [1] 20 10 20 mA Power Dissipation 48 38 52 mW Reverse Voltage 5 5 5 V –40 to +85 –40 to +85 See reflow soldering profile (Figure 6 & 7) ˚C ˚C LED Junction Temperature 95 95 95 ˚C Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. 2 Free Datasheet http://www.Datasheet-PDF.com/ Electrical Characteristics at TA = 25° C Forward Voltage VF (Volts) @ IF[1] Color Typ. Max. AlInGaP Red AlInGaP Amber AlInGaP Red[2] AlInGaP Amber[2] InGaN Green InGaN Blue HE.


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