Document
1 of page 8 Specification of NHE520-HF-6/7 File No:NHS-08905-
Specification
To: Co., Ltd.
Name of products High Sensitivity type Hall Element
Model NHE 520-HF-6/7
Acceptance of Customer(s) Please send back 1 set of this specification
with your signature for acceptance
Date
5 Sep. 2008
NIPPON CERAMIC CO.,LTD
APPROVED CHECKED
FACTURE
Free Datasheet http://www.datasheet4u.net/
2 of page 8 Specification of NHE520-HF-6/7 1.Absolute Maximum Ratings Item Max.Control current Operating temp. Storage temp.
Input Voltage Derating Curve
2 Input Current (mA) Input Voltage (V) 20
Symbol Ic max Topr Tstg
Rating 40℃current drived
20 -40~+110 -40~+125
Unit mA ℃ ℃
Note: without restriction resistance, stay within input voltage derating curve envelope
Input Current Derating Curve
1
10
0 -60
-40
-20
0
20 40 60 Anbient Temp. (℃)
80
100
120
140
0 -60
-40
-20
0
20 40 60 Anbient Temp. (℃)
80
100
120
140
2. Electrical Characteristics Item Hall voltage Offset voltage Input resistance Output resistance Temp.coeff. of VH Temp.coeff. of resistance *VH=VHM-Vo Symbol VH Vo Rin Rout αHI Condition Min Standard Max Vc=1V, B=50mT 228 320 Vc=1V, B=0mT -7 +7 Ic=1mA, B=0mT 240 550 Ic=1mA,B=0mT 240 550 Average on 0~40℃ for -2 20℃ base B=50mT Ic=5mA Average on 0~40℃ for -2 20℃ base B=0mT Ic=0.1mA VHM : Measured value of Hall voltage at 50mT Vo : Offset voltage Unit mV mV Ω Ω %/℃
βR
%/℃
3. Classification of rank for Hall voltage and Printed indication Classification of rank for Hall voltage Indication of model(Rank) *VH(mV) Name of Rank Printing NHE520-HF- □ 228~274 6 6 (□ is showing name of Rank) 266~320 7 7 HF: Halogen - Free
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3 of page 8 Specification of NHE520-HF-6/7 4. Guarantee conditions for mounting mini-mould package (1) Recommended conditions for soldering the product to the substrate 1) Please avoid heating and cooling the main body rapidly. 2) Preheating should be done for 2~3 min. at 150~200℃ 3) Soldering for 5 sec. at 245~260℃ is the best condition for soldering (example: reflow). (2) Soldering method and guaranteed temperature. 1) Soldering Method Method Reflow Solder dip Soldering Iron Conditions Soldering is done in high temp circumstances Soldering is done in the dipping sink for solder. Repair soldering parts of the lead wire by using the soldering iron. Temp. MAX260℃ 10sec. MAX260℃ 10sec. 350℃ within 3sec.
2) Range of guaranteed temp. Reflow
Solder dip
Temp. ( ℃ )) (℃ 260
5 Max. 5sec.
Natural cooling or Forced cooling
Temp. ( ℃ )) (℃ 260
5 5sec. Max.
Natural cooling or Forced cooling
15sec. Max.
15sec. Max.
150
3min. (Range of guaranteed temp)
150
3min. (Range of guaranteed temp)
25
)
25
)
Guaranteed Value (at Highest temp.) Method Temp Time Reflow 260℃ 5sec. Dip 260℃ 5sec.
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4 of page 8 Specification of NHE520-HF-6/7 5. Description of packing (1) Structure of taping
Direction of pulling out of the tape Tra.