AWT6113

AWT6113 PCS/CDMA 3.4V/28dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.4 FEATURES InGaP HBT Technology High Efficiency: 38% Low Quiescent Current: 44 mA Low Leakage Current in Shutdown Mode: <1 µA Optimized for a 50 Ω System Low Profile Surface Mount Package: 1.56mm max CDMA 1XRTT Compliant CDMA 1xEV-DO Compliant APPLICATIONS PCS CDMA Wireless Handsets Dual Band CDMA Wireless Handsets M7 Package 10 Pin 4mm x 4mm Surface Mount Module PRODUCT DESCRIPTION The AWT6113 is a high power, high efficiency amplifier module for PCS/CDMA wireless handset applications. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, serve to increase handset talk and standby time. The self-contained 4mm x 4mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system. GND at slug (pad) VCC RFIN GND 1 2 3 Bias Control 10 VCC 9 8 7 6 GND RFOUT GND GND VMODE 4 VREF 5 Figure 1: Block Diagram 12/2002 Free Datasheet http://www.datasheet4u.com/ AWT6113 GND VCC RFIN GND VMODE VREF 1 2 3 4 5 GND Figure 2: Pinout (X-ray Top View) 10 VCC 9 8 7 6 GND RFOUT GND GND Table 1: Pin Description PIN 1 2 3 4 5 6 7 8 9 10 NAME V CC RFIN GND VMODE VREF GND GND RFOUT GND V CC DESCRIPTION Supply...