HEXFET Power MOSFET
IRFHM831PbF
HEXFET® Power MOSFET
VDS
RDS(on) max
(@VGS = 10V)
Qg (typical) RG (typical)
ID
(@Tc(Bottom) = 25°C)
30 V
7...
Description
IRFHM831PbF
HEXFET® Power MOSFET
VDS
RDS(on) max
(@VGS = 10V)
Qg (typical) RG (typical)
ID
(@Tc(Bottom) = 25°C)
30 V
7.8 m:
7.3 nC
0.5 :
40h A
PQFN 3.3mm x 3.3mm
Applications
Control MOSFET for Buck Converters
Features and Benefits
Features
Low Charge (typical 7.3nC) Low Thermal Resistance to PCB (<4.7°C/W) 100% Rg tested Low Profile (<1.0mm)
Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Industrial Qualification
Benefits
Lower Switching Losses Enable Better Thermal Dissipation Increased Reliability results in Increased Power Density
⇒ Multi-Vendor Compatibility
Easier Manufacturing Environmentally Friendlier Increased Reliability
Orderable part number
IRFHM831TRPbF IRFHM831TR2PbF
Package Type
PQFN 3.3mm x 3.3mm PQFN 3.3mm x 3.3mm
Standard Pack
Form
Quantity
Tape and Reel
4000
Tape and Reel
400
Note EOL notice # 259
Absolute Maximum Ratings
VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C IDM PD @TA = 25°C PD @ TC(Bottom) = 25°C
TJ TSTG
Parameter Drain-to-Source Voltage
Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V
cContinuous Drain Current, VGS @ 10V
Pulsed Drain Current
gPower Dissipation gPower Dissipation gLinear Derating Factor
Operating Junction and
Storage Temperature Range
Max. 30 ±20 14 11
40h
28 96 2.5 27
0.02 -55 to + 150
Units V
...
Similar Datasheet